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HHM1763B2 is listed in the Balun range at ChipApex. The manufacturer field lists TDK Corporation. Its product description is BALUN 880MHZ-960MHZ 50/150 0603. Review the specifications below when checking this part for your BOM.
The HHM1763B2 is a multilayer RF balun manufactured by TDK Corporation, designed for surface-mount applications in the 880MHz to 960MHz frequency range. It features a 50/150 Ohm impedance configuration and utilizes a compact 0603 (1.6x0.8mm) package. The component supports tape and reel packaging for automated assembly processes.
Verify component authenticity through authorized TDK distributors or official channels. Confirm that the received parts match the HHM1763B2 designation and packaging specifications. Ensure handling procedures comply with electrostatic discharge precautions appropriate for sensitive RF components during storage and installation.
Select this component when a compact solution is required for balancing signals in the 880-960MHz spectrum. The 0603 footprint suits space-constrained designs. Note that the manufacturer indicates this part is not recommended for new designs; consider evaluating alternative current-generation baluns for future projects to ensure long-term supply availability.
This component belongs to TDK's line of passive RF devices, specifically multilayer baluns used in wireless infrastructure and consumer electronics. It complements other RF components like filters and antennas by providing necessary signal conditioning. The product represents TDK's expertise in miniaturized electronic components for high-frequency applications.
TDK explicitly states this part is not recommended for new designs. Engineers should consult TDK's current product portfolio for equivalent or improved balun solutions suitable for new development cycles to avoid potential obsolescence issues.
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