Balun HHM1779B1 product image

HHM1779B1

$0.45
  • Description:BALUN 2.11-2.17GHZ 50/100 0603
  • Series:HHM
  • Mfr:TDK Corporation
  • Package:Tape & Reel (TR),Cut Tape (CT)

SKU:762fad5aa73b Category: Brand:

  
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HHM1779B1 is listed in the Balun range at ChipApex. The manufacturer field lists TDK Corporation. Its product description is BALUN 2.11-2.17GHZ 50/100 0603. Review the specifications below when checking this part for your BOM.

Balun specifications for HHM1779B1

  • Description:BALUN 2.11-2.17GHZ 50/100 0603
  • Series:HHM
  • Mfr:TDK Corporation
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • Frequency Range:2.11GHz 2.17GHz
  • Impedance - Unbalanced/Balanced:50 / 100Ohm
  • Phase Difference:190°
  • Insertion Loss (Max):0.8dB
  • Return Loss (Min):-10dB
  • Package / Case:0603 (1608 Metric), 6 PC Pad
  • Mounting Type:Surface Mount

Balun datasheet and documents for HHM1779B1

HHM1779B1

Balun Overview

The HHM1779B1 is a multilayer RF balun manufactured by TDK Corporation, designed for high-frequency signal conversion. It operates within a frequency range of 2.11GHz to 2.17GHz, supporting impedance transformation between 50 Ohms (unbalanced) and 100 Ohms (balanced). The component features a maximum insertion loss of 0.8dB and a phase difference of 190°. It exhibits a minimum return loss of -10dB and utilizes a surface-mount 0603 (1608 metric) package with six PCB pads. The device complies with RoHS3 standards and has a Moisture Sensitivity Level (MSL) rating of 1.

Balun Feature Summary

  • Converts single-ended signals to differential signals using multilayer technology
  • Maintains stable phase characteristics across the specified GHz frequency band
  • Optimized for minimal signal attenuation in compact surface-mount layouts

Balun Applications

  • Wireless LAN modules operating in the 2.4GHz ISM band
  • Bluetooth low energy transceivers
  • RF front-end circuits requiring balanced-to-unbalanced impedance matching

Balun Procurement Notes

Verify current availability status as this component is officially listed as obsolete. Confirm that any replacement parts meet identical electrical specifications for frequency range, impedance ratios, and insertion loss. Ensure compatibility with existing PCB footprint dimensions and soldering profiles before integrating substitute components into production designs.

Balun Selection Notes

Select this component for applications requiring precise 50-ohm to 100-ohm impedance transformation in compact form factors. Consider the specific phase difference requirements and insertion loss limits when designing RF paths. Verify that the operating environment aligns with the component's thermal and mechanical specifications for reliable long-term performance.

Balun Part Context

This part belongs to the HHM series of multilayer baluns from TDK, engineered for RF wireless communications. These components are integral to modern mobile devices and IoT hardware where space constraints necessitate small-footprint solutions. The series supports various impedance configurations tailored to different wireless standards.

Balun Replacement Considerations

TDK recommends the HHM1927A4 as a manufacturer-recommended alternative. Verify technical equivalence regarding frequency coverage and impedance ratios before substitution.

HHM1779B1HHM1779B1
$0.45
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