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HI0805N600R-10 is listed in the Chip Ferrite Bead range at ChipApex. The manufacturer field lists Laird-Signal Integrity Products. Its product description is FERRITE BEAD 60 OHM 0805 1LN. Review the specifications below when checking this part for your BOM.
The HI0805N600R-10 is a single-line ferrite bead from the HI series, designed for EMI filtering in power and signal applications. It features an 0805 (2012 metric) surface-mount package with dimensions of 2.00mm x 1.25mm and a maximum height of 0.90mm. The component provides an impedance of 60 Ohms at 100 MHz and supports a rated current of 3A. Its maximum DC resistance is 40 milliohms, and it operates within a temperature range of -40°C to 125°C.
Verify the specific suffix 'N' against official datasheets to confirm impedance tolerance and material composition, as variations exist within the HI series. Confirm RoHS compliance status directly with the manufacturer, as historical data indicates potential non-compliance for certain variants in this family. Ensure the selected packaging matches automated assembly requirements.
Select this component when a 60 Ohm impedance at 100 MHz is required for 3A applications. The 0805 package offers a balance between current capacity and board space efficiency compared to smaller footprints. Consider the low DC resistance to minimize voltage drop and power loss in sensitive power rails.
This part belongs to Laird-Signal Integrity Products' HI series, which focuses on high-current ferrite chip beads. The series is characterized by its ability to handle significant DC bias currents while maintaining effective noise suppression. The HI series is widely used in consumer electronics and industrial equipment requiring robust EMI control.
Direct substitutes include MI0805K110R-10 for similar form factors with different impedance characteristics. Other compatible options may include BLM21PG220SN1D from Murata, though electrical parameters such as impedance and current rating must be carefully matched to ensure functional equivalence.
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