HI1806N910R-10

Chip Ferrite Bead Overview

The HI1806N910R-10 is a single-line ferrite bead manufactured by Laird-Signal Integrity Products, designed for surface-mount assembly in the 1806 (4516 Metric) package. It provides an impedance of 91 Ohms at 100 MHz and supports a maximum rated current of 3A with a maximum DC resistance of 30 mOhm. The component operates within a temperature range of -40°C to 125°C and measures 4.50mm in length by 1.60mm in width.

Chip Ferrite Bead Feature Summary

• Provides electromagnetic interference filtering for power and signal lines
• Supports high-current applications up to 3A
• Features low DC resistance for minimal signal loss

Chip Ferrite Bead Applications

• Power line filtering
• Signal line filtering

Chip Ferrite Bead Procurement Notes

Verify component authenticity through authorized distributors or direct manufacturer channels. Confirm RoHS compliance status and lead times prior to ordering. Ensure storage conditions meet moisture sensitivity requirements if applicable. Cross-reference datasheet specifications against design constraints to validate performance suitability.

Chip Ferrite Bead Selection Notes

Select this component when a 91 Ohm impedance at 100 MHz is required for EMI suppression in compact designs. The 1806 package offers a balance between current handling capacity and board space efficiency. Consider the 3A rating and low DCR for power integrity in high-current signal paths.

Chip Ferrite Bead Part Context

This ferrite bead belongs to the HI series from Laird-Signal Integrity Products, specialized for high-current EMI filtering. It complements other components in the LI and HI families, offering various impedance values and package sizes to address diverse circuit protection needs across industrial and consumer electronics.

Chip Ferrite Bead Replacement Considerations

Direct substitutes include equivalent ferrite beads with matching 91 Ohm impedance and 1806 footprint. Verify current ratings and DC resistance limits to ensure compatibility with existing thermal and electrical design parameters.