HIP6018CB

Overview

The HIP6018CB is a power management integrated circuit designed for high-performance microprocessor and computer applications. It provides power control and protection for three output voltages, featuring one synchronous step-down (buck) converter and two linear regulators (LDOs). The device operates with a supply voltage range of 10.8V to 13.2V and includes an integrated sequencer. It functions within an operating temperature range of 0°C to 70°C (TA) and is housed in a 24-SOIC surface-mount package.

Feature Summary

• Integrates one synchronous buck converter and two LDOs for multi-rail power delivery
• Includes built-in sequencing logic for controlled power-up and power-down
• Provides comprehensive protection mechanisms for system reliability

Applications

• High-performance microprocessor power systems
• Computer motherboard power distribution
• Multi-voltage rail power management units

Procurement Notes

Verify the manufacturer designation, as Harris Corporation's semiconductor assets were acquired by Intersil and subsequently Renesas. Ensure the datasheet corresponds to the specific revision. Confirm the package type matches the required PCB footprint. Check for any suffix variations that may indicate tape-and-reel packaging or extended temperature ranges. Validate authenticity through authorized distributors.

Selection Notes

Select this component when a single IC solution is needed for three distinct voltage rails in computing hardware. It is suitable for designs requiring synchronized switching regulation alongside low-noise linear outputs. Consider the thermal performance of the 24-SOIC package relative to the board layout. Verify that the input voltage range aligns with the system's main power supply rails.

Part Context

This part belongs to the HIP6018 family of power controllers. It was originally produced by Harris Semiconductor before the company's acquisition by Intersil. The device addresses the complexity of powering modern processors by consolidating multiple regulator stages into a single compact package, reducing component count and board space requirements.

Replacement Considerations

Check for direct pin-compatible alternatives from Intersil or Renesas catalogs. Verify if updated revisions exist with improved efficiency or extended temperature ranges. Ensure substitute parts maintain the same output configuration of one buck and two LDOs.