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HLMA-PL00-N0011 is listed in the LED Indication - Discrete range at ChipApex. The manufacturer field lists Broadcom Limited. Its product description is LED AMBER CLEAR SMD. Review the specifications below when checking this part for your BOM.
The HLMA-PL00-N0011 is a single-color amber LED from the Broadcom SunPower series, utilizing AlInGaP technology. It features a flat top package with an untinted, non-diffused truncated lens designed for wide radiation patterns. Key electrical parameters include a peak wavelength of 590 nm, a forward voltage of 1.9 V at a test current of 20 mA, and a power rating of 120 mW. The device emits an optical intensity of 75 mcd with a viewing angle of 125 degrees. It operates within a temperature range of -40°C to +100°C and is supplied in a reel package.
Verify RoHS compliance status and Moisture Sensitivity Level (MSL) ratings prior to assembly planning. Confirm that the specific ordering suffix matches the required binning or packaging format. Ensure component handling procedures align with the specified humidity sensitivity classification to prevent damage during soldering processes.
Select this component when a wide beam angle and high brightness are required for direct illumination or light pipe coupling. The flat top geometry distinguishes it from dome packages, offering different optical characteristics. Verify that the 125-degree viewing angle meets the system's field-of-view requirements compared to narrower beam alternatives.
This part belongs to the HLMX-PXXX series of subminiature high-performance AlInGaP LED lamps manufactured by Broadcom Limited. The series utilizes a flat top package architecture to deliver superior luminous intensity and wide radiation patterns, distinguishing it from traditional dome-style LED indicators in compact electronic assemblies.
Consult official substitution lists for compatible variants within the HLMA-PL00 family. Verify optical intensity bins and wavelength tolerances to ensure performance parity. Cross-reference mechanical dimensions to confirm fitment compatibility in existing PCB layouts.
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