HLMP-EG55-HJ000

Overview

The HLMP-EG55-HJ000 is a single-color red LED from the HLMP-EG55 series, manufactured by Broadcom Limited. It utilizes a T-1 3/4 (5 mm) through-hole package with a diffused lens. The component emits light at a peak wavelength of 626 nm. Key electrical parameters include a forward voltage of approximately 2.1 V and a test current of 20 mA. Optical performance features a viewing angle of 55 degrees and a luminous intensity of up to 310 mcd.

Feature Summary

• Emits monochromatic red light at a 626 nm peak wavelength
• Features a 55-degree viewing angle for directional visibility
• Constructed in a standard T-1 3/4 through-hole package

Applications

• Panel status indicators
• Equipment power state signaling
• Control board visual feedback

Procurement Notes

Verify the specific ordering suffix against the official Broadcom datasheet to confirm optical and mechanical tolerances. Ensure the procurement channel provides valid RoHS compliance documentation. Confirm that the component matches the required lead-free specifications for your assembly process. Check for any recent product change notices affecting material composition or testing standards.

Selection Notes

Select this component when a standard 5mm red indicator is required for through-hole mounting. The 626 nm wavelength ensures distinct red visibility in industrial environments. Consider the 55-degree beam width for applications requiring focused rather than wide-angle illumination. Verify that the 20 mA drive current aligns with the system's power budget and logic levels.

Part Context

This part belongs to the HLMP-EG55 family of high-brightness LEDs. The series is designed for general-purpose indication tasks. Broadcom offers various color and lens options within this form factor. The T-1 3/4 size remains a common standard for front-panel applications.

Replacement Considerations

Consult the official cross-reference guide for direct substitutes. Generic equivalents may differ in luminous intensity or spectral purity. Verify pin compatibility and thermal characteristics before substitution.