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HLMP-LM75-34QDD is listed in the LED Indication - Discrete range at ChipApex. The manufacturer field lists Broadcom Limited. Its product description is LED GREEN DIFFUSED 4MM OVAL T/H. Review the specifications below when checking this part for your BOM.
The HLMP-LM75-34QDD is a through-hole light-emitting diode manufactured by Broadcom Limited. It features a blue lens and emits green light with a peak wavelength of 565 nm. The component utilizes a T-1 3/4 (5mm) package design with two pins for mounting. Typical forward voltage is specified at 2.2 V when tested at a current of 20 mA. The device provides a luminous intensity of 8 mcd and offers a viewing angle of 30 x 70 degrees. Its physical dimensions are approximately 5.4 mm in width and 8.7 mm in length, suitable for standard panel or board applications requiring visible indication.
Verify the specific suffix code against official Broadcom documentation to confirm optical characteristics and binning. Ensure compatibility with existing fixture designs for through-hole assembly processes. Confirm lead-free compliance requirements if applicable to your manufacturing standards. Cross-reference datasheet revisions to ensure parameter consistency.
Select this component where green visibility is required alongside a blue aesthetic housing. Consider the 30 x 70 degree viewing angle for directional indication needs. Evaluate the 2.2 V forward voltage drop for circuit driver compatibility. Ensure mechanical fit within the 5.4 x 8.7 mm footprint constraints of the target enclosure.
This part belongs to Broadcom's discrete LED portfolio, specifically the HLMP series designed for general indication purposes. These components are engineered for reliability in consumer electronics and industrial equipment. The T-1 3/4 form factor remains a standard choice for legacy and modern panel interfaces requiring robust visual feedback.
Consult official substitution guides for equivalent green LEDs with matching pin configurations and luminous intensity ranges. Verify that alternative packages maintain the same mechanical dimensions and thermal characteristics.
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