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Product Detailed Parameters
- Description:IC RF AMP GPS 2GHZ-22GHZ DIE
- Series:-
- Mfr:Analog Devices Inc.
- Package:Bulk,Tray
- Frequency:2GHz ~ 22GHz
- P1dB:14dBm
- Gain:16dB
- Noise Figure:1.7dB
- RF Type:General Purpose
- Voltage - Supply:4V
- Current - Supply:45mA
- Test Frequency:-
- Mounting Type:Surface Mount
- Package / Case:Die
- Supplier Device Package:Die
- Grade:-
- Qualification:-
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Overview
The HMC-ALH482-SX is a GaAs MMIC HEMT low noise wideband amplifier die manufactured by Analog Devices Inc. It operates within a frequency range of 2 GHz to 22 GHz. The component provides a gain of 16 dB and achieves a noise figure of 1.7 dB. It utilizes GaAs technology and is supplied in a die package format suitable for surface mount applications.
Feature Summary
- Utilizes GaAs MMIC HEMT technology for high-performance amplification
- Provides wideband operation across the 2 GHz to 22 GHz spectrum
- Designed as a low noise amplifier with specified gain characteristics
Applications
- Radar systems requiring wideband signal processing
- Electronic warfare applications involving signal detection
- Test and measurement equipment operating in microwave frequencies
Procurement Notes
Verify component authenticity through authorized Analog Devices channels or certified distributors. Confirm datasheet revisions and specific lot traceability requirements before integration. Ensure handling procedures account for the bare die packaging format to prevent physical damage during assembly.
Selection Notes
Select this component when a wide bandwidth covering 2 GHz to 22 GHz is required alongside low noise performance. The 16 dB gain specification suits applications needing moderate signal amplification without additional stages. Consider the GaAs technology benefits for high-frequency stability and thermal performance in compact designs.
Part Context
This part belongs to the HMC-ALH series of low noise amplifiers from Analog Devices, designed for RF and microwave applications. The -SX suffix typically denotes a specific tape-and-reel or waffle pack configuration for the die, facilitating automated placement in high-volume manufacturing environments compared to loose die handling.
Replacement Considerations
Public confirmed substitute part numbers are not available in the provided documentation. Consult Analog Devices technical support for direct replacements or cross-reference options based on specific electrical parameter tolerances.
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