HMC-AUH232-SX

$429.06

Description：IC RF AMP GPS 0HZ-43GHZ DIE
Series：-
Mfr：Analog Devices Inc.
Package：Tray

SKU:41b873fac4c2 Category: RF Amplifiers Brand: Analog Devices Inc.

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Product introduction

Product Detailed Parameters

Description：IC RF AMP GPS 0HZ-43GHZ DIE
Series：-
Mfr：Analog Devices Inc.
Package：Tray
Frequency：0Hz ~ 43GHz
P1dB：16.5dBm
Gain：14dB
Noise Figure：4.6dB
RF Type：General Purpose
Voltage - Supply：5V
Current - Supply：180mA
Test Frequency：-
Mounting Type：Surface Mount
Package / Case：Die
Supplier Device Package：Die
Grade：-
Qualification：-

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HMC-AUH232-SX

Overview

The HMC-AUH232-SX is a GaAs MMIC HEMT distributed driver amplifier die from Analog Devices Inc. It operates over a frequency range of 0Hz to 43GHz, providing a typical 3dB bandwidth of 46GHz. The component delivers a gain of 14dB and a noise figure of 4.6dB. Key performance metrics include a P1dB compression point of 16.5dBm. Designed for wideband applications, it utilizes a die package format suitable for surface mount integration in high-frequency RF signal chains.

Feature Summary

Wideband distributed amplification architecture covering DC to 43GHz
GaAs MMIC HEMT technology for high-frequency performance
Driver amplifier configuration optimized for signal chain integration

Applications

Wideband RF signal chain distribution
High-frequency driver stages in communication systems
Test and measurement equipment requiring broad bandwidth

Procurement Notes

Verify the specific datasheet version and official documentation directly from Analog Devices Inc. before integration. Confirm that the die-level packaging requirements align with your assembly capabilities. Ensure compliance with RoHS standards as indicated in official product specifications. Cross-reference part numbers carefully to avoid confusion with similar series components.

Selection Notes

Select this component when a wideband driver amplifier is required for frequencies extending up to 43GHz. Consider the GaAs MMIC technology for its suitability in high-speed applications. Evaluate the 14dB gain and 16.5dBm output power against system linearity requirements. Ensure thermal management strategies are compatible with die-mount implementations.

Part Context

This component belongs to the HMC-AUH232 series of wideband distributed amplifiers. It serves as a driver stage within larger RF systems, bridging lower-power sources to subsequent amplification or mixing stages. The die format allows for flexible integration into custom substrates or multi-chip modules designed for millimeter-wave applications.