HMC-XTB110

Overview

The HMC-XTB110 is a monolithic passive x3 frequency multiplier utilizing GaAs Schottky diode technology. It operates with an input frequency range of 23.3 GHz to 30 GHz, generating an output at three times the input frequency within the 70 GHz to 90 GHz band. The device requires no DC power supply and exhibits low conversion loss alongside high fundamental-to-output isolation. Supplied in die form factor, it is designed for direct generation of higher frequencies from lower source signals.

Feature Summary

• Monolithic passive design using GaAs Schottky diode technology
• Provides x3 frequency multiplication without requiring DC power
• High isolation between fundamental input and multiplied output frequency

Applications

• Radar systems operating in millimeter-wave bands
• Wireless communication links requiring frequency up-conversion
• Test and measurement equipment for signal generation

Procurement Notes

Verify the specific package configuration when ordering, as the component is available in both bare die and substrate-mounted variants such as the HMC-XTB110-SX. Confirm that the application circuit supports the required input power levels to ensure optimal conversion efficiency. Ensure proper handling procedures are followed due to the sensitive nature of the GaAs MMIC structure.

Selection Notes

Select this component when a passive solution is preferred to eliminate bias current requirements. It is suitable for applications demanding high linearity and wide bandwidth within the specified millimeter-wave range. Consider thermal management strategies appropriate for die-level components if integrating directly into substrates.

Part Context

This part belongs to Analog Devices' portfolio of RF frequency multipliers. It complements other active and passive MMIC solutions by offering a compact, low-power option for frequency synthesis. The technology leverages established GaAs processes to deliver reliable performance in harsh RF environments.

Replacement Considerations

Check for availability of the HMC-XTB110-SX variant if a packaged solution is required instead of the bare die. Evaluate alternative x3 multipliers from the manufacturer's catalog if pin compatibility or specific isolation metrics differ from system requirements.