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Product Detailed Parameters
- Description:IC AMP GP 27.5-33.5GHZ DIE 1=2PC
- Series:-
- Mfr:Analog Devices Inc.
- Package:Bulk
- Frequency:27.5GHz ~ 33.5GHz
- P1dB:28.5dBm
- Gain:23.5dB
- Noise Figure:-
- RF Type:General Purpose
- Voltage - Supply:5V
- Current - Supply:600mA
- Test Frequency:30GHz ~ 33.5GHz
- Mounting Type:Surface Mount
- Package / Case:Die
- Supplier Device Package:Die
- Grade:-
- Qualification:-
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Overview
The HMC1024-SX is a four-stage GaAs pHEMT monolithic microwave integrated circuit (MMIC) power amplifier manufactured by Analog Devices Inc. Designed for operation in the 27.5 to 33.5 GHz frequency range, this component delivers a typical gain of 23.5 dB and a saturated output power of 28.5 dBm. It requires a 5V supply voltage and draws 600mA of current. The device is supplied as an exposed die intended for surface-mount installation.
Feature Summary
- Four-stage GaAs pHEMT MMIC architecture
- High output power capability at millimeter-wave frequencies
- Exposed die package for direct mounting
Applications
- Point-to-point communication links
- Satellite communication systems
- Electronic warfare applications
Procurement Notes
Verify the specific suffix designation against official Analog Devices documentation to confirm exact electrical characteristics and pinout configuration. Ensure that the procurement channel provides original manufacturer components with traceable lot numbers. Confirm RoHS compliance status and moisture sensitivity level prior to integration into the manufacturing process.
Selection Notes
Select this component when high output power is required within the 27.5 to 33.5 GHz band. The exposed die format necessitates specialized PCB design and assembly techniques. Evaluate thermal management requirements carefully due to the 600mA supply current consumption and power dissipation inherent in high-power amplification stages.
Part Context
This part belongs to the HMC1024 series of high-power amplifiers from Analog Devices. The -SX suffix typically denotes a specific tape-and-reel or waffle-pack packaging variant of the bare die, distinct from other packaging options available within the same functional family.
Replacement Considerations
Consult official Analog Devices substitution guides for verified alternatives. Generic cross-references are not recommended due to precise impedance matching and biasing requirements unique to this MMIC design.
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