HMC1040CHIPS

Description：IC RF AMP GPS 20GHZ-44GHZ DIE
Series：-
Mfr：Analog Devices Inc.
Package：Bulk

SKU:3dd3f937600c Category: RF Amplifiers Brand: Analog Devices Inc.

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Product introduction

Product Detailed Parameters

Description：IC RF AMP GPS 20GHZ-44GHZ DIE
Series：-
Mfr：Analog Devices Inc.
Package：Bulk
Frequency：20GHz ~ 44GHz
P1dB：14dBm
Gain：21dB
Noise Figure：2.5dB
RF Type：General Purpose
Voltage - Supply：2.3V ~ 3.5V
Current - Supply：65mA
Test Frequency：40GHz ~ 44GHz
Mounting Type：Surface Mount
Package / Case：Die
Supplier Device Package：Die
Grade：-
Qualification：-

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HMC1040CHIPS

Overview

The HMC1040CHIPS is a GaAs pHEMT MMIC low noise amplifier operating from 20 GHz to 44 GHz. It features a typical gain of 25.0 dB and a noise figure of 2.5 dB. The device provides a P1dB output power of 13.5 dBm and an OIP3 of 22.5 dBm within the 24-32 GHz range. Operating voltage is 2.5 V with a current consumption of 70 mA. Power dissipation is 490 mW. The chip measures 1.309 mm x 1.48 mm x 0.102 mm.

Feature Summary

Utilizes GaAs pHEMT technology for high-performance microwave amplification
Provides broadband operation across the 20 GHz to 44 GHz frequency spectrum
Delivers high linearity with significant output power capabilities
Maintains low noise characteristics for sensitive signal reception

Applications

Software Defined Radio (SDR) systems
Electronic Warfare (EW) equipment
Radar transceivers
Satellite communication links
Precision test and measurement instruments

Procurement Notes

Verify component authenticity through authorized Analog Devices channels or certified distributors. Confirm RoHS compliance status prior to integration. Ensure handling procedures account for the bare die format to prevent mechanical damage. Review the latest datasheet revision for any updates to absolute maximum ratings or thermal specifications before finalizing design implementations.

Selection Notes

Select this component when wideband coverage from 20 GHz to 44 GHz is required in a compact form factor. It is suitable for designs prioritizing low noise figures alongside moderate output power levels. Consider the bare die package requirements if board-level integration allows for direct mounting. Evaluate thermal management needs given the 490 mW power dissipation profile during continuous operation.

Part Context

This part belongs to the HMC1040 series of monolithic microwave integrated circuits. It represents a specialized solution for millimeter-wave applications requiring integrated amplification without external matching networks. The device complements other RF components in high-frequency system architectures by providing essential signal conditioning and gain stages.