HMC1040LP3CE

Overview

The HMC1040LP3CE is a self-biased GaAs MMIC Low Noise Amplifier operating between 24 and 43.5 GHz. It provides 23 dB of small-signal gain with a noise figure of 2.2 dB. The device features a P1dB compression point of 12 dBm and an OIP3 of 22 dBm. It operates on a 2.5 V supply with a current draw of 70 mA, resulting in 490 mW power dissipation. Input return loss is 12 dB. It is housed in a leadless 3x3 mm plastic surface mount package (QFN-16) and functions within a temperature range of -40°C to +85°C.

Feature Summary

• Self-biased GaAs MMIC architecture eliminates external bias circuitry requirements
• Broadband operation across the 24 to 43.5 GHz frequency range
• High linearity performance with 22 dBm output third-order intercept point
• Compact leadless 3x3 mm plastic surface mount packaging

Applications

• VSAT communication systems
• Point-to-point microwave links
• Satellite communications receivers
• Test and measurement instrumentation

Procurement Notes

Verify component authenticity through authorized Analog Devices distributors or certified partners. Confirm that the received part matches the HMC1040LP3CE marking and package type. Check datasheet revisions for any updates to electrical characteristics or mechanical dimensions. Ensure storage conditions comply with moisture sensitivity levels specified in the manufacturer's guidelines prior to assembly.

Selection Notes

Select this component when designing high-frequency receiver front-ends requiring low noise and high gain in the Ka-band spectrum. The self-biasing feature simplifies PCB layout by reducing passive component count. Consider the 2.5V supply requirement and thermal management needs due to 490mW dissipation in the small QFN-16 package. Evaluate system linearity requirements against the 22 dBm OIP3 specification.

Part Context

This part belongs to the HMC1040 series of broadband low-noise amplifiers from Analog Devices. It utilizes GaAs pHEMT technology optimized for high-frequency performance. The LP3 suffix indicates the specific leadless plastic surface mount package variant designed for automated assembly processes in compact RF modules.

Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation.