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Product Detailed Parameters
- Description:IC RF AMP GPS 2GHZ-6GHZ DIE
- Series:-
- Mfr:Analog Devices Inc.
- Package:Tray
- Frequency:2GHz ~ 6GHz
- P1dB:-
- Gain:23dB
- Noise Figure:-
- RF Type:General Purpose
- Voltage - Supply:28V
- Current - Supply:1.1A
- Test Frequency:2GHz ~ 4GHz
- Mounting Type:Surface Mount
- Package / Case:Die
- Supplier Device Package:Die
- Grade:-
- Qualification:-
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Overview
The HMC1086-SX is a Gallium Nitride (GaN) MMIC power amplifier manufactured by Analog Devices Inc. It operates in the frequency range of 2 GHz to 6 GHz and delivers an output power of 25 Watts. The device typically provides 22 dB of small-signal gain. It requires a supply voltage of 28V and draws a supply current of 1.1A. The component is housed in a die package for surface mount installation.
Feature Summary
- Utilizes Gallium Nitride (GaN) technology for high-power performance
- Provides wideband operation across the 2 GHz to 6 GHz spectrum
- Designed as a single-channel monolithic microwave integrated circuit
Applications
- High-frequency power amplification systems
- Military radar transmitters
- Electronic warfare equipment
- Test and measurement instrumentation
Procurement Notes
Verify the specific suffix 'SX' indicates the die configuration when sourcing. Confirm that the 28V supply requirement aligns with your system design. Ensure proper handling procedures are followed due to the exposed die package type. Check for RoHS3 compliance status if required by your manufacturing standards.
Selection Notes
Select this component when high output power and broad bandwidth are critical requirements. Consider the thermal management needs associated with 25W GaN devices. Evaluate the 28V supply constraint against available power rails. Compare gain specifications against alternative MMICs if signal chain linearity is a primary concern.
Part Context
This part belongs to the HMC1086 family of GaN MMIC power amplifiers from Analog Devices. The -SX suffix denotes the bare die version, distinct from packaged variants. These components are engineered for demanding RF applications requiring robust power handling and efficiency in compact form factors.
Replacement Considerations
Public confirmed substitute part numbers: None identified.
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