HMC1105-SX

Overview

The HMC1105-SX is a passive miniature frequency doubler MMIC die. It utilizes GaAs Schottky diode and balun technology to multiply input signals within the 20 GHz to 40 GHz range, producing output frequencies from 40 GHz to 80 GHz. The device requires no DC bias and adds no measurable additive phase noise. Typical suppression of undesired fundamental harmonics is up to 41 dB, with higher-order harmonic suppression reaching 46 dB relative to the input signal level. Conversion loss is typically 12 dB. The die dimensions are 1.79 x 1.19 x 0.1 mm.

Feature Summary

• Passive operation requiring no DC bias voltage
• High suppression of undesired fundamental and higher-order harmonics
• No measurable additive phase noise contribution
• Compatible with conventional die attach methods for hybrid integration

Applications

• Microwave test equipment
• Microwave and mmWave radios
• E-Band radio systems
• Military and space applications

Procurement Notes

Verify that the specific suffix '-SX' denotes the bare die configuration rather than a packaged variant. Confirm compatibility with standard die attach processes for multi-chip modules or hybrid microcircuits. Ensure RF probe contact methods are utilized during initial characterization, as datasheet parameters are measured in a 50-ohm environment using this technique. Validate that the application design accounts for the specified conversion loss and harmonic isolation requirements.

Selection Notes

Select this component when a passive, low-phase-noise frequency doubling solution is required for high-frequency microwave applications. The absence of DC bias simplifies power management in sensitive environments. Consider the small die size for compact hybrid circuit designs. Verify that the input frequency range aligns with the 20-40 GHz specification to ensure proper multiplication to the 40-80 GHz output band.

Part Context

The HMC1105 belongs to Analog Devices' family of GaAs MMIC components, sharing technology with Hittite mixers. As a bare die product, it is intended for integration into custom substrates or multi-chip modules rather than direct PCB mounting. This form factor supports high-density packaging strategies typical in advanced microwave and millimeter-wave system architectures.

Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation.