HMC1114LP5DETR

Overview

The HMC1114LP5DETR is a GaN driver amplifier from Analog Devices, operating within the 2.7 GHz to 3.8 GHz frequency range. It utilizes an LFCSP-32 package and requires a 28 V supply with a typical current of 150 mA. The device delivers 35 dB gain, achieving a P1dB compression point of 41.5 dBm and an OIP3 of 44 dBm. Input return loss is specified at 25 dB, while power dissipation reaches 24 W. It supports operation between -40°C and +85°C.

Feature Summary

• Utilizes Gallium Nitride (GaN) technology for high-power RF amplification
• Provides high linearity performance with significant output IP3
• Designed for SMD/SMT surface mount installation in compact layouts

Applications

• Point-to-point microwave radio systems
• Satellite communication ground stations
• Electronic warfare subsystems

Procurement Notes

Verify component authenticity through authorized Analog Devices channels or certified distributors. Confirm lot traceability and RoHS compliance status prior to integration. Ensure storage conditions respect humidity sensitivity levels to prevent package degradation during handling and assembly processes.

Selection Notes

Select this component when high output power and linearity are critical in the C-band spectrum. Evaluate thermal management requirements due to substantial power dissipation capabilities. Compare against alternative GaN drivers based on specific gain flatness and impedance matching needs within the target application architecture.

Part Context

This part belongs to the HMC1114 series of high-performance RF amplifiers. It serves as a driver stage, bridging lower-power signal sources to final power amplifiers. The LP5 suffix indicates the specific LFCSP-32 package configuration optimized for high-frequency thermal and electrical performance.

Replacement Considerations

HMC1114PM5E offers similar specifications but may differ in packaging or minor electrical tolerances. HMC1114LP5DE is the non-tray variant of the same core device. Verify pinout compatibility and thermal pad connections before substitution.