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HMC260A-SX is listed in the RF Mixers range at ChipApex. The manufacturer field lists Analog Devices Inc.. Its product description is GAAS MMIC FUNDAMENTAL MIXER. Review the specifications below when checking this part for your BOM.
The HMC260A-SX is a GaAs MMIC fundamental mixer designed for high-frequency applications. It operates within a radio frequency range of 10 GHz to 26 GHz and supports an intermediate frequency from 0 Hz to 8 GHz. The device features a maximum conversion loss of 12 dB and a noise figure of 10 dB. Key performance metrics include an output third-order intercept point (OIP3) of 23 dBm and a P1dB compression point of 13 dBm. Power dissipation is rated at 260 mW, with an operating temperature range spanning from -40°C to +85°C. The component utilizes an LCC-12 package.
Verify the specific suffix designation against official Analog Devices documentation to confirm exact physical dimensions and handling requirements. Confirm that the procurement channel provides valid traceability for this die-level component. Ensure compliance with moisture sensitivity levels and electrostatic discharge precautions during storage and assembly processes.
Select this component when designing systems requiring fundamental mixing in the Ka-band spectrum. Evaluate the trade-off between the specified 12 dB conversion loss and the 10 dB noise figure against system link budget requirements. Consider the thermal management capabilities required for the 260 mW power dissipation rating within the target application environment.
This part belongs to the HMC260 series of RF mixers manufactured by Analog Devices Inc. The series focuses on providing reliable mixing solutions for high-frequency wireless applications using established GaAs MMIC processes. The SX suffix typically denotes specific packaging or handling configurations for die components intended for custom substrate integration.
The HMC260ALC3B is a related variant within the same product family offering similar electrical specifications but potentially differing in packaging configuration. Verify compatibility regarding interface requirements and mechanical integration before substituting.
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