HMC263

Overview

The HMC263 is a GaAs MMIC Low Noise Amplifier (LNA) designed for the 24 to 36 GHz frequency range. It operates on a single 3 V supply with a current consumption of 58 mA. The device provides a typical gain of 22 dB and a noise figure of 2 dB. Key performance metrics include a P1dB compression point of 5 dBm and an OIP3 of 13 dBm. Input return loss is specified at 10 dB. The component dissipates 692 mW of power and functions within a temperature range of -55°C to +85°C. It is supplied as a bare die in gel pack packaging.

Feature Summary

• Utilizes GaAs MMIC technology for high-frequency operation
• Designed for easy integration into multi-chip modules
• Provides low noise amplification in the Ka-band spectrum

Applications

• Multi-Chip Module (MCM) integration
• Point-to-Point Microwave Radio Systems
• Satellite Communications Terminals

Procurement Notes

Verify availability status carefully, as this part may be subject to limited supply or factory special orders. Confirm that the specific die form factor matches your substrate design requirements. Ensure thermal management solutions account for the 692 mW power dissipation. Check for any specific handling instructions related to the gel pack packaging to prevent contamination or damage to the exposed die surface during assembly.

Selection Notes

Select the HMC263 when a bare die LNA solution is required for custom RF front-end designs operating between 24 and 36 GHz. Consider its small footprint and low noise figure for sensitive receiver applications. Evaluate the need for external matching networks if the integrated input return loss does not meet system impedance requirements. Compare against packaged alternatives like the HMC263LP4E if board space allows for standard SMT components.

Part Context

The HMC263 belongs to Analog Devices' portfolio of GaAs MMICs targeting high-frequency wireless communications. It serves as a fundamental building block for Ka-band systems requiring compact, high-performance amplification. As a die-level component, it offers designers flexibility in substrate selection and thermal routing compared to pre-packaged variants.

Replacement Considerations

The HMC263LP4E is a documented substitute offering similar functionality in a QFN-24 package.