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Product Detailed Parameters
- Description:IC RF AMP WLL 3GHZ-4GHZ 8MSOP
- Series:-
- Mfr:Analog Devices Inc.
- Package:Tape & Reel (TR),Bulk
- Frequency:3GHz ~ 4GHz
- P1dB:27dBm
- Gain:21dB
- Noise Figure:5dB
- RF Type:WLL, WLAN
- Voltage - Supply:5V
- Current - Supply:250mA
- Test Frequency:3.5GHz
- Mounting Type:Surface Mount
- Package / Case:8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Exposed Pad
- Supplier Device Package:8-MSOP-EP
- Grade:-
- Qualification:-
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Overview
The HMC327MS8GTR is a GaAs InGaP HBT MMIC power amplifier designed for surface mount applications. It operates within the 3 to 4 GHz frequency range, providing a typical gain of 21 dB and a noise figure of 5 dB. The device is housed in an 8-lead MSOP package with an exposed pad, suitable for wireless local loop and WLAN systems.
Feature Summary
- Utilizes GaAs InGaP HBT technology for robust performance
- Designed as a monolithic microwave integrated circuit (MMIC)
- Optimized for high-frequency RF power amplification
Applications
- Wireless Local Loop (WLL) systems
- Wireless Local Area Network (WLAN) infrastructure
- Point-to-point radio links
Procurement Notes
Verify the specific ordering suffix 'GTR' corresponds to the tape-and-reel packaging configuration required for your assembly line. Confirm that the 8-MSOP exposed pad footprint matches your PCB design guidelines. Ensure compliance with RoHS standards if mandated by your regional regulations or end-product requirements before finalizing procurement.
Selection Notes
Select this component when a compact, high-gain solution is needed for the S-band spectrum. The exposed pad design facilitates thermal management, making it suitable for dense layouts. Consider the 21 dB gain profile against system link budget requirements. Evaluate the 5 dB noise figure impact on overall receiver sensitivity if used in transmit chains.
Part Context
This part belongs to Analog Devices' HMC series of RF MMICs, which are engineered for reliability in harsh environments. The HMC327 specifically targets the 3-4 GHz band, bridging the gap between lower frequency control circuits and higher frequency millimeter-wave solutions. It represents a mature technology node for cost-effective RF front-end modules.
Replacement Considerations
Check for direct pin-compatible alternatives within the same manufacturer's portfolio that offer updated packaging or enhanced thermal specifications. Verify functional equivalence regarding gain flatness and output power levels before substituting.
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