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The HMC361 is a low-noise divide-by-2 static frequency divider implemented using InGaP GaAs HBT technology. It operates from DC (with square wave input) to 11 GHz. The device requires a single +5V DC supply and delivers an output power of 3 dBm. Its compact die size measures 1.14 x 0.69 mm, facilitating integration into space-constrained RF systems.
Verify the specific package variant required, as the HMC361 family includes bare die options like HMC361-DIE and packaged versions such as HMC361G8. Confirm availability status directly with Analog Devices or authorized distributors, as supply constraints may apply. Ensure handling procedures match the selected package type, particularly for bare die components requiring specialized mounting techniques.
Select the HMC361 when a low-noise, high-frequency divide-by-2 solution is needed within a limited form factor. Consider the HMC361G8 if a surface-mount package is preferred over bare die implementation. Evaluate the 11 GHz upper frequency limit against system requirements. Ensure the design supports the single +5V supply rail and accommodates the specific thermal and mechanical constraints of the chosen package style.
The HMC361 belongs to Analog Devices' HMC series of monolithic microwave integrated circuits (MMICs). It utilizes InGaP GaAs HBT technology, which offers a balance of speed and noise performance. This component serves as a fundamental building block for frequency scaling in RF signal chains, providing reliable division ratios at microwave frequencies.
HMC361G8 is a packaged version of the same core function. HMC361-SX is another variant available in waffle pack format. Verify pinout compatibility and electrical specifications before substituting.