HMC361

HMC361

  • Description:IC FREQ DIVID DC-10GHZ DIE
  • Series:-
  • Mfr:Analog Devices Inc.
  • Package:Tray

SKU:d0b97b08b93e Category: Brand:

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Product Detailed Parameters

  • Description:IC FREQ DIVID DC-10GHZ DIE
  • Series:-
  • Mfr:Analog Devices Inc.
  • Package:Tray
  • Function:Frequency Doubler
  • Frequency:12GHz ~ 18GHz
  • RF Type:VSAT
  • Secondary Attributes:-
  • Mounting Type:Surface Mount
  • Package / Case:Die
  • Supplier Device Package:Die
  • Grade:-
  • Qualification:-

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HMC361

Overview

The HMC361 is a low-noise divide-by-2 static frequency divider implemented using InGaP GaAs HBT technology. It operates from DC (with square wave input) to 11 GHz. The device requires a single +5V DC supply and delivers an output power of 3 dBm. Its compact die size measures 1.14 x 0.69 mm, facilitating integration into space-constrained RF systems.

Feature Summary

  • Implements divide-by-2 static division functionality using InGaP GaAs HBT technology for low noise performance
  • Operates across a wide frequency range from DC to 11 GHz with square wave input capability
  • Features a compact die footprint of 1.14 x 0.69 mm suitable for miniaturized designs
  • Requires only a single +5V DC power supply for operation

Applications

  • Frequency synthesis circuits in communication systems
  • Local oscillator chains in radar systems
  • Test and measurement equipment requiring precise frequency division
  • VSAT satellite communication terminals

Procurement Notes

Verify the specific package variant required, as the HMC361 family includes bare die options like HMC361-DIE and packaged versions such as HMC361G8. Confirm availability status directly with Analog Devices or authorized distributors, as supply constraints may apply. Ensure handling procedures match the selected package type, particularly for bare die components requiring specialized mounting techniques.

Selection Notes

Select the HMC361 when a low-noise, high-frequency divide-by-2 solution is needed within a limited form factor. Consider the HMC361G8 if a surface-mount package is preferred over bare die implementation. Evaluate the 11 GHz upper frequency limit against system requirements. Ensure the design supports the single +5V supply rail and accommodates the specific thermal and mechanical constraints of the chosen package style.

Part Context

The HMC361 belongs to Analog Devices' HMC series of monolithic microwave integrated circuits (MMICs). It utilizes InGaP GaAs HBT technology, which offers a balance of speed and noise performance. This component serves as a fundamental building block for frequency scaling in RF signal chains, providing reliable division ratios at microwave frequencies.

Replacement Considerations

HMC361G8 is a packaged version of the same core function. HMC361-SX is another variant available in waffle pack format. Verify pinout compatibility and electrical specifications before substituting.

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