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The HMC361G8TR is a low-noise divide-by-2 static frequency divider implemented in GaAs HBT MMIC technology. It operates within a frequency range of 10 MHz to 13 GHz. The device is housed in an 8-lead glass/metal surface mount package, specifically the 8-SOIC form factor with a width of 4.40 mm. Designed for high-performance RF applications, it provides reliable signal division capabilities suitable for VSAT systems and other microwave circuits requiring precise frequency scaling.
Verify that the specific suffix 'TR' corresponds to the tape-and-reel packaging variant rather than the standard tray or bulk options often associated with the base HMC361G8 part number. Confirm RoHS compliance status and lead-free specifications directly with Analog Devices documentation to ensure alignment with environmental regulations. Cross-reference the exact package dimensions against the 8-SOIC specification to guarantee compatibility with existing PCB footprints and assembly processes.
Select this component when a divide-by-2 function is required up to 13 GHz with low noise requirements. Ensure the design supports surface mount assembly compatible with the 8-SOIC footprint. Consider thermal management needs as the device utilizes a glass/metal package which may differ from standard plastic SMT components in terms of heat dissipation characteristics during operation.
This part belongs to the HMC361 series of static dividers manufactured by Analog Devices Inc. It shares functional similarities with related models like the HMC361S8G but differs in packaging and potentially supply chain configuration. The series is designed for high-frequency applications where stable division ratios are critical for system synchronization and signal generation tasks.
The HMC361S8G serves as a verified alternative within the same family, offering similar divide-by-2 functionality. Verify pinout compatibility and package dimensional tolerances before substitution. Other series members like HMC364 provide different division ratios and should not be used as direct replacements without circuit redesign.