HMC370LP4

HMC370LP4

$36.44
  • Description:IC X4 ACTIVE MULTIPLIER 24SMD
  • Series:-
  • Mfr:Analog Devices Inc.
  • Package:Strip

SKU:517cb31cbc13 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC X4 ACTIVE MULTIPLIER 24SMD
  • Series:-
  • Mfr:Analog Devices Inc.
  • Package:Strip
  • Function:Frequency Multiplier
  • Frequency:14.4GHz ~ 16.4GHz
  • RF Type:General Purpose
  • Secondary Attributes:Active Frequency Multiplier
  • Mounting Type:Surface Mount
  • Package / Case:24-VFQFN Exposed Pad
  • Supplier Device Package:24-QFN (4x4)
  • Grade:-
  • Qualification:-

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HMC370LP4

Overview

The HMC370LP4 is an active miniature x4 frequency multiplier utilizing InGaP GaAs HBT technology. It operates within a frequency range of 14.4 GHz to 16.4 GHz for the output frequency. The device requires a supply voltage between 4.5 V and 5.5 V, drawing a typical operating current of 55 mA. It features a QFN-24 surface-mount package with dimensions of 4x4 mm. The component supports an input frequency up to 16.4 GHz and dissipates up to 530 mW of power. It functions reliably across a temperature range from -40°C to +85°C.

Feature Summary

  • Integrates active multiplication functionality using InGaP GaAs HBT technology for high-frequency performance.
  • Provides a fixed x4 multiplication ratio suitable for generating higher harmonic frequencies from lower input signals.
  • Utilizes a compact leadless surface-mount package designed for efficient integration into dense RF circuit layouts.

Applications

  • Microwave communication systems requiring frequency synthesis
  • Test and measurement equipment needing stable high-frequency sources
  • Radar subsystems utilizing frequency multiplication techniques

Procurement Notes

Verify component authenticity through authorized Analog Devices distributors or certified partners. Confirm RoHS compliance status as indicated in official documentation, noting specific regulatory markings. Ensure storage and handling procedures adhere to moisture sensitivity levels defined in the datasheet to prevent package damage during reflow soldering processes.

Selection Notes

Select this component when a fixed x4 multiplication factor is required within the 14.4 GHz to 16.4 GHz output band. Consider the 55 mA current consumption and 530 mW power dissipation for thermal management design. The QFN-24 package dictates PCB footprint constraints and thermal pad requirements for adequate heat sinking.

Part Context

Part of the HMC370 series, this device represents a specialized RF integrated circuit solution. It belongs to the Wireless & RF Integrated Circuits subcategory under Analog Devices' portfolio. The LP4 suffix denotes the specific leadless surface-mount package configuration used for this variant.

Replacement Considerations

No public confirmed substitute part numbers are available in the provided documentation.

HMC370LP4HMC370LP4
$36.44
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