HMC383

Overview

The HMC383 is a GaAs PHEMT MMIC medium power amplifier designed for operation between 12 and 30 GHz. It delivers 16 dB of gain with a noise figure of 9 dB. The device operates on a 5 V supply, drawing 101 mA. Key performance metrics include a 1 dB compression point (P1dB) of 16.5 dBm and an output third-order intercept point (OIP3) of 25 dBm. Power dissipation is rated at 890 mW. It functions within a temperature range of -55°C to +85°C. Input return loss is specified at 14 dB. The component is supplied in a die package format.

Feature Summary

• Utilizes GaAs PHEMT technology for robust high-frequency performance
• Provides general-purpose driver amplification capabilities
• Engineered for VSAT applications within the Ku-band spectrum

Applications

• VSAT communication systems
• Point-to-point microwave links
• Satellite ground station uplinks

Procurement Notes

Verify current availability status as supply may be restricted or limited. Confirm that the specific die package variant matches the design-in requirements. Ensure thermal management solutions account for the 890 mW power dissipation rating. Validate that the operating voltage and current specifications align with the system power budget. Check for any obsolescence notices or lifecycle changes from Analog Devices before finalizing procurement plans.

Selection Notes

Select this component when a monolithic solution is required for 12-30 GHz frequency ranges. Consider the die package format if custom PCB integration is feasible. Evaluate the 16 dB gain against system link budgets. Assess the 9 dB noise figure impact on receiver sensitivity. Compare power consumption against battery-operated constraints. Verify compatibility with existing RF matching networks for optimal impedance transformation.

Part Context

This part belongs to the HMC383G series of RF amplifiers manufactured by Analog Devices. It serves as a driver stage in wider signal chains. The family includes variants like HMC383LC4TR for surface mount applications. This specific model represents the bare die version for specialized packaging needs.

Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation.