HMC392

Overview

The HMC392 is a GaAs MMIC Low Noise Amplifier die designed for operation between 3.5 GHz and 7.0 GHz. It provides 15.5 dB of gain with a noise figure of 2.4 dB. The device operates on a 5 V supply, drawing 50 mA current. Key performance metrics include a P1dB compression point of 16 dBm and an OIP3 of 28 dBm. Input return loss is specified at 15 dB. Power dissipation is rated at 640 mW. The component supports a temperature range from -55°C to +85°C.

Feature Summary

• Utilizes GaAs MMIC technology for low noise amplification in the 3.5 to 7.0 GHz frequency band.
• Provides high linearity with a third-order intercept point of 28 dBm and a 1 dB compression point of 16 dBm.
• Features a compact bare die package suitable for surface mount integration.

Applications

• GPS receiver front-ends
• Satellite communication systems
• Point-to-point microwave links

Procurement Notes

Verify availability status carefully as this component may be subject to limited supply or discontinuation notices. Confirm that the specific die form factor matches your PCB layout requirements. Ensure thermal management solutions account for the 640 mW power dissipation rating during design validation.

Selection Notes

Select this component when a bare die GaAs LNA is required for frequencies up to 7.0 GHz. Compare against packaged alternatives like the HMC392LH5 if board space constraints differ. Consider the HMC392ALC4TR for applications requiring a standard CLCC package rather than a custom die attachment solution.

Part Context

The HMC392 belongs to the Analog Devices HMC392G series of RF amplifiers. It is part of the broader portfolio of wireless and RF integrated circuits. This specific item represents the unencapsulated die version, distinct from packaged variants such as the HMC392LC4TR-AN which utilizes silicon technology.

Replacement Considerations

Public confirmed substitute part numbers are not explicitly documented in the provided source material. Evaluate the HMC392LH5 (GaAs QFN) or HMC392ALC4TR (Si CLCC) based on packaging and technology compatibility.