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Product Detailed Parameters
- Description:IC RF AMP GPS 0HZ-4GHZ DIE
- Series:-
- Mfr:Analog Devices Inc.
- Package:Tray
- Frequency:0Hz ~ 4GHz
- P1dB:15dBm
- Gain:16dB
- Noise Figure:4.5dB
- RF Type:General Purpose
- Voltage - Supply:5V
- Current - Supply:54mA
- Test Frequency:0Hz ~ 4GHz
- Mounting Type:Surface Mount
- Package / Case:Die
- Supplier Device Package:Die
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Overview
The HMC395-SX is a GaAs InGaP HBT gain block MMIC amplifier die from Analog Devices Inc. It operates over a frequency range of DC to 4 GHz. Key electrical parameters include a typical gain of 16 dB, a P1dB output power of 15 dBm, and a noise figure of 4.5 dB. The device requires a supply voltage of 5V and draws a supply current of 35 mA. It is supplied in a gel pack package.
Feature Summary
- Utilizes GaAs InGaP Heterojunction Bipolar Transistor (HBT) technology for high performance
- Provides wideband amplification from DC up to 4 GHz
- Designed as a bare die component for integration into custom RF circuits
Applications
- General purpose RF amplification
- Wireless communication systems
- Test and measurement equipment
Procurement Notes
Verify the specific revision level and lot traceability requirements with the manufacturer or authorized distributor before ordering. Confirm that the receiving facility has appropriate ESD protection and handling procedures for bare die components. Ensure compatibility with the intended substrate and bonding processes for successful integration into the final assembly.
Selection Notes
Select this component when a broadband DC-4 GHz gain stage is required with moderate output power capabilities. The 5V supply requirement should be considered during power budget planning. Evaluate the thermal management needs for the bare die implementation within the target application environment to ensure reliable operation under continuous load conditions.
Part Context
This part belongs to the HMC395 series of InGaP HBT MMICs. It serves as a versatile gain block solution for engineers designing RF front-ends. The -SX suffix indicates the specific packaging format as a die in a gel pack, distinguishing it from other package variants in the product family.
Replacement Considerations
Consult official Analog Devices documentation for verified cross-reference part numbers. Do not substitute with generic equivalents without validating electrical parameter compatibility and pinout definitions against the original datasheet specifications.
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