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HMC457QS16GTR
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Product Detailed Parameters
- Description：IC AMP CDMA 1.7GHZ-2.2GHZ 16QSOP
- Series：-
- Mfr：Hittite
- Package：Bulk
- Frequency：1.7GHz ~ 2.2GHz
- P1dB：30.5dBm
- Gain：27dB
- Noise Figure：6dB
- RF Type：CDMA, GSM, WCDMA
- Voltage - Supply：5V
- Current - Supply：500mA
- Test Frequency：1.7GHz ~ 2.2GHz
- Mounting Type：Surface Mount
- Package / Case：16-SSOP (0.154", 3.90mm Width) Exposed Pad
- Supplier Device Package：16-QSOP-EP
- Grade：-
- Qualification：-
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Overview
The HMC457QS16GTR is a narrow band medium power amplifier designed for RF applications. It operates within a frequency range of 1.7GHz to 2.2GHz. Key electrical specifications include a P1dB output power of 30.5dBm, a gain of 27dB, and a noise figure of 6dB. The device requires a supply voltage of 5V and draws a supply current of 725mA. It is housed in a 16-QSOP-EP surface mount package.
Feature Summary
- Narrow band medium power amplification capability
- Surface mount 16-QSOP-EP packaging
- Designed for base station and repeater environments
Applications
- CDMA Base Stations
- W-CDMA Base Stations
- GSM Base Stations
- Repeaters
Procurement Notes
Verify the product status carefully as multiple sources indicate this component may be obsolete or discontinued. Confirm availability with authorized distributors before procurement planning. Ensure the 16-QSOP-EP package type matches your PCB footprint requirements. Validate that the 5V supply and 725mA current draw are compatible with your system design constraints prior to ordering.
Selection Notes
Select this component for applications requiring specific narrow band amplification between 1.7GHz and 2.2GHz. Consider the 30.5dBm P1dB output power for medium power requirements. Evaluate the 27dB gain against system link budget needs. Ensure the 6dB noise figure meets sensitivity requirements for the intended application environment.
Part Context
This part belongs to the Hittite microwave amplifier family, specifically engineered for cellular infrastructure. It serves as a critical component in signal chain architectures for wireless communication systems. The QSOP-EP package provides thermal performance suitable for dense mounting configurations in base station hardware.
Replacement Considerations
Public confirmed substitute part numbers are not available in the provided documentation. Due to the potentially obsolete status, direct replacements should be verified through official manufacturer channels or approved alternative component lists.
