HMC460LC5TR-R5

Overview

The HMC460LC5TR-R5 is a GaAs MMIC pHEMT low noise distributed amplifier designed for surface mount applications. It operates from DC to 20 GHz with a typical gain of 14 dB and a noise figure of 4 dB. The device requires an 8 V supply voltage and draws 60 mA of current. It features a P1dB compression point of 17 dBm and is housed in a 32-CSMT (5x5 mm) leadless ceramic package.

Feature Summary

• Utilizes GaAs pHEMT technology for high-performance RF amplification
• Distributed amplifier architecture ensures wideband operation from DC to 20 GHz
• Integrated low noise design optimizes signal integrity for sensitive receiver chains

Applications

• VSAT communication systems
• GPS receiver front-ends
• Wideband test and measurement equipment

Procurement Notes

Verify the specific suffix -R5 indicates reel packaging when sourcing. Confirm RoHS3 compliance status through official Analog Devices documentation prior to integration. Ensure ESD handling protocols are followed due to the sensitivity of the GaAs MMIC structure during assembly and testing procedures.

Selection Notes

Select this component when a wide bandwidth extending to 20 GHz is required alongside low noise performance. The 14 dB gain and 17 dBm output power suit direct conversion or intermediate frequency stages. Consider the 32-pin QFN package for compact PCB layouts requiring thermal dissipation through exposed pads.

Part Context

This part belongs to the HMC460 family of low noise amplifiers from Analog Devices. It shares the core die and functional characteristics with the HMC460LC5, differing primarily in the tape-and-reel packaging configuration (-R5 suffix) intended for automated surface mount manufacturing processes rather than manual placement.

Replacement Considerations

The HMC460LC5 serves as the primary equivalent variant, offering identical electrical specifications but typically in cut-tape or tray packaging. Verify that the system's pick-and-place equipment supports the specific reel format of the -R5 suffix if transitioning between these two packaging options.