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Product Detailed Parameters
- Description:IC AMP CDMA 1.7GHZ-2.2GHZ 16QFN
- Series:-
- Mfr:Analog Devices Inc.
- Package:Tape & Reel (TR)
- Frequency:1.7GHz ~ 2.2GHz
- P1dB:29.5dBm
- Gain:12.5dB
- Noise Figure:6.5dB
- RF Type:CDMA, EDGE, GPRS, GSM, W-CDMA
- Voltage - Supply:5V
- Current - Supply:300mA
- Test Frequency:-
- Mounting Type:Surface Mount
- Package / Case:16-VFQFN Exposed Pad
- Supplier Device Package:16-QFN (3x3)
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Overview
The HMC461LP3ETR is a high-linearity radio frequency power amplifier manufactured by Analog Devices Inc. utilizing GaAs PHEMT MMIC technology. Designed for surface-mount applications, it operates within the 1.7 GHz to 2.2 GHz frequency range. The device delivers an output power of 1 Watt (30 dBm) with a typical gain of 18 dB and a noise figure of 5.5 dB. It features a 16-lead VFQFN package with an exposed pad for thermal management. Key performance metrics include a P1dB compression point of 23 dBm and a third-order intercept point (OIP3) of 33 dBm. The amplifier requires a supply voltage of 5 V and draws approximately 1 A of current, dissipating up to 5 W of power.
Feature Summary
- High linearity performance suitable for demanding RF signal chain applications
- Integrated GaAs PHEMT MMIC design for robust operation
- Surface-mount compatible 16-lead VFQFN package with exposed thermal pad
Applications
- Wireless infrastructure base stations
- Point-to-point microwave radio systems
- Test and measurement instrumentation equipment
Procurement Notes
Verify component authenticity through authorized Analog Devices distributors or certified partners. Request official datasheets and material compliance documentation prior to integration. Confirm package marking and pinout alignment with reference designs. Ensure supply chain integrity to mitigate counterfeit risks. Validate thermal and electrical specifications against final system requirements before procurement commitment.
Selection Notes
Select this component for applications requiring high output power and linearity in the L-band spectrum. Evaluate thermal dissipation capabilities due to significant power consumption. Compare gain and noise characteristics against alternative amplifiers in the target frequency band. Consider the exposed pad requirement for effective heat sinking during PCB layout. Assess compatibility with existing biasing networks and impedance matching circuits.
Part Context
This part belongs to the Hittite Microwave Corporation product family, now integrated into Analog Devices Inc. following acquisition. The HMC461 series focuses on medium-power RF amplification using advanced GaAs processes. It complements other components in the wireless communication portfolio, providing standardized solutions for linear amplification needs across various industrial and commercial sectors.
Replacement Considerations
Public confirmed substitute part numbers are not available in the provided source data.
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