HMC461LP3ETR

HMC461LP3ETR

$9.34
  • Description:IC AMP CDMA 1.7GHZ-2.2GHZ 16QFN
  • Series:-
  • Mfr:Hittite
  • Package:Bulk

SKU:162a1ee5a47c Category: Brand:

  
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Product Detailed Parameters

  • Description:IC AMP CDMA 1.7GHZ-2.2GHZ 16QFN
  • Series:-
  • Mfr:Hittite
  • Package:Bulk
  • Frequency:1.7GHz ~ 2.2GHz
  • P1dB:29.5dBm
  • Gain:12.5dB
  • Noise Figure:6.5dB
  • RF Type:CDMA, EDGE, GPRS, GSM, W-CDMA
  • Voltage - Supply:5V
  • Current - Supply:300mA
  • Test Frequency:-
  • Mounting Type:Surface Mount
  • Package / Case:16-VFQFN Exposed Pad
  • Supplier Device Package:16-QFN (3x3)
  • Grade:-
  • Qualification:-

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HMC461LP3ETR

Overview

The HMC461LP3ETR is a GaAs MMIC RF amplifier designed for high linearity and power output in the 1.7 GHz to 2.2 GHz frequency range. It provides a typical gain of 12.5 dB with an output power of 1 Watt (30 dBm). The device operates on a single 5 V supply, drawing approximately 300 mA. Key performance metrics include a third-order intercept point (IP3) of 38 dBm and a noise figure of 3.5 dB. It is housed in a 16-lead VFQFN package with an exposed thermal pad.

Feature Summary

  • High linear output power capability suitable for demanding RF applications
  • Integrated GaAs MMIC technology ensuring compact form factor
  • Exposed base design for superior thermal dissipation and RF performance
  • Single 5V supply operation simplifying bias circuitry

Applications

  • CDMA base station amplifiers
  • EDGE and GPRS infrastructure
  • W-CDMA signal processing chains

Procurement Notes

Verify the specific suffix 'E' and 'TR' to confirm the lead-free RoHS-compliant variant and tape-and-reel packaging format. Ensure the supplier provides official datasheets matching the Hittite/Analog Devices specifications for the 1.7-2.2 GHz band. Confirm that the exposed pad connection requirements are met by the receiving PCB layout for proper thermal management.

Selection Notes

Select this component when high linearity and 1W output power are required within the cellular uplink bands. Compare against lower-power variants if system constraints allow reduced output. Consider the thermal resistance of the VFQFN package and ensure adequate copper area on the PCB for heat sinking. Verify compatibility with 5V logic control interfaces if integrated switching is needed.

Part Context

This part belongs to the Hittite LP3 series of GaAs MMICs, characterized by their use of an exposed metal pad for enhanced thermal handling. The series targets wireless communication infrastructure, offering a balance between gain, linearity, and power efficiency. The HMC461 specifically addresses the 1.7-2.2 GHz spectrum used in various mobile network standards.

Replacement Considerations

Public confirmed substitute part numbers: None identified in provided documentation.

HMC461LP3ETRHMC461LP3ETR
$9.34
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