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Product Detailed Parameters
- Description:IC RF AMP GPS 2GHZ-20GHZ DIE
- Series:-
- Mfr:Analog Devices Inc.
- Package:Tray
- Frequency:2GHz ~ 20GHz
- P1dB:26dBm
- Gain:16dB
- Noise Figure:4dB
- RF Type:General Purpose
- Voltage - Supply:8V
- Current - Supply:290mA
- Test Frequency:-
- Mounting Type:Surface Mount
- Package / Case:Die
- Supplier Device Package:Die
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Overview
The HMC464-SX is a wideband power amplifier die manufactured by Analog Devices Inc. It operates within a frequency range of 2 GHz to 20 GHz. The device provides a typical gain of 14 dB and maintains a noise figure of 6 dB. It requires a supply voltage between 7.5 V and 8.5 V. The component is designed for surface mount installation in a die package format.
Feature Summary
- Wideband amplification capability across the 2 GHz to 20 GHz spectrum
- High linearity performance suitable for demanding RF applications
- Integrated design optimized for compact system integration
Applications
- Test and measurement instrumentation
- Wireless communication base stations
- Satellite communication systems
Procurement Notes
Verify the specific datasheet revision and electrical test conditions provided by Analog Devices before finalizing the design. Ensure that the procurement source supplies genuine components with traceable documentation. Confirm that the die package handling requirements align with the assembly capabilities of the manufacturing facility to prevent physical damage during installation.
Selection Notes
Select this component when a wideband solution covering up to 20 GHz is required. Consider the 14 dB gain and 6 dB noise figure against system link budget requirements. Evaluate the thermal management needs associated with the die package and the specified 7.5 V to 8.5 V operating voltage range for proper biasing circuit design.
Part Context
This part belongs to the HMC464 series of wideband power amplifiers from Analog Devices. It is offered as a bare die, requiring custom mounting solutions. The SX suffix typically denotes a specific packaging or testing configuration for the die form factor, distinguishing it from packaged variants in the same product family.
Replacement Considerations
Public confirmed substitute part numbers are not available in the provided documentation.
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