HMC464LP5E

Overview

The HMC464LP5E is a GaAs PHEMT MMIC distributed power amplifier designed for W-band applications. It operates across a frequency range of 2 GHz to 20 GHz. The device provides 14 dB of gain and delivers +26 dBm output power at 1 dB gain compression. Key performance metrics include +30 dBm output IP3 and a noise figure of 6 dB. It requires a single +8V supply with a current consumption of 290 mA. The component is housed in a leadless 5x5 mm surface mount package, specifically a 32-VFQFN Exposed Pad CSP.

Feature Summary

• Utilizes GaAs PHEMT technology for high-frequency performance
• Distributed amplifier architecture ensures wide bandwidth operation
• Integrated bias network compatibility via broadband bias tee

Applications

• Point-to-point microwave radio links
• Electronic warfare systems
• Radar subsystems

Procurement Notes

Verify the specific suffix (E) against the manufacturer's latest documentation to confirm RoHS compliance status and material composition. Ensure that the procurement channel provides traceability to Analog Devices Inc. as the original manufacturer. Confirm that the delivered units are free from physical damage to the exposed pad thermal interface, which is critical for proper heat dissipation in this QFN-32 package configuration.

Selection Notes

Select this component when a wideband solution covering 2 to 20 GHz is required without discrete tuning components. The integrated design simplifies PCB layout compared to discrete transistor solutions. Consider the 290 mA supply current for power budget calculations. The exposed pad package necessitates adequate thermal management on the PCB substrate to maintain reliability under continuous wave operation at maximum output power levels.

Part Context

This part belongs to Analog Devices' HMC series of monolithic microwave integrated circuits. These components are engineered for high-reliability RF and microwave applications. The LP5E designation indicates a specific leadless surface mount variant optimized for automated assembly. The family focuses on providing high linearity and gain flatness across broad frequency spans using advanced semiconductor processes.

Replacement Considerations

HMC464-DIE