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Product Detailed Parameters
- Description:IC RF AMP VSAT 21GHZ-32GHZ DIE
- Series:-
- Mfr:Analog Devices Inc.
- Package:Tray
- Frequency:21GHz ~ 32GHz
- P1dB:23dBm
- Gain:16dB
- Noise Figure:5dB
- RF Type:VSAT, DBS
- Voltage - Supply:5V
- Current - Supply:200mA
- Test Frequency:24GHz ~ 28GHz
- Mounting Type:Surface Mount
- Package / Case:Die
- Supplier Device Package:Die
- Grade:-
- Qualification:-
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Overview
The HMC499-SX is a GaAs PHEMT MMIC medium power amplifier from Analog Devices Inc., designed for operation within the 21 GHz to 32 GHz frequency range. This single-channel device delivers a typical gain of 16 dB with a noise figure of 5 dB. It features an input return loss of 8 dB and operates on a single supply voltage. The component is supplied in die form, suitable for surface mount integration into high-frequency RF systems requiring reliable medium-power amplification capabilities.
Feature Summary
- Utilizes GaAs PHEMT technology for robust high-frequency performance
- Engineered as a medium power amplifier for signal chain applications
- Provides stable gain characteristics across the 21-32 GHz band
Applications
- Point-to-point microwave communication links
- Satellite communication uplink and downlink stages
- Electronic warfare and radar subsystems
Procurement Notes
Verify that the specific lot code matches current manufacturing standards. Confirm compatibility with your PCB layout regarding thermal dissipation requirements for the die package. Ensure proper handling procedures are followed due to the sensitivity of the exposed die structure during assembly and testing phases.
Selection Notes
Select this component when a compact solution is required for Ka-band applications. Consider the trade-off between the 16 dB gain and the 5 dB noise figure against system link budget requirements. Evaluate the need for external matching networks to optimize impedance at the specific operating frequencies within the specified bandwidth.
Part Context
This part belongs to the HMC499 series of medium power amplifiers. The -SX suffix indicates the component is provided as a bare die rather than a packaged module. This format allows for custom integration into larger multi-chip modules or specialized substrates where space constraints are critical.
Replacement Considerations
Public confirmed substitute part numbers are not available in the provided documentation.
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