HMC561LP3

Overview

The HMC561LP3 is a x2 active broadband frequency multiplier utilizing GaAs PHEMT technology in a leadless RoHS compliant SMT package. It operates within an output frequency range of 8 GHz to 21 GHz. The device delivers high output power of +14 dBm and requires low input drive power ranging from 0 to +6 dBm. Key performance metrics include Fo isolation of 15 dBc at Fout = 16 GHz and 100 KHz SSB phase noise of -139 dBc/Hz. It functions on a supply voltage between 4.5 V and 5.5 V with a typical current draw of 98 mA, housed in a QFN-16 package.

Feature Summary

• Active x2 frequency multiplication using GaAs PHEMT technology
• Broadband operation covering 8 GHz to 21 GHz output frequencies
• High output power capability of +14 dBm with low input drive requirements
• Leadless surface mount package compliant with RoHS standards

Applications

• Microwave communication systems requiring frequency synthesis
• Test and measurement equipment for signal generation
• Radar systems needing stable high-frequency sources
• Satellite communication transceivers

Procurement Notes

Verify component authenticity through authorized Analog Devices channels or certified distributors. Confirm the specific lot date code and RoHS compliance status against the latest manufacturer documentation. Ensure storage conditions adhere to moisture sensitivity levels defined in the datasheet. Check for any end-of-life notices or discontinuance alerts prior to final procurement decisions to mitigate supply chain risks.

Selection Notes

Select this component when a compact solution for doubling frequencies up to 21 GHz is required. Consider the GaAs PHEMT process for its balance of linearity and power efficiency. Evaluate thermal management needs given the 635 mW power dissipation rating. Ensure the driving source can provide the necessary 0 to +6 dBm input power for optimal performance.

Part Context

The HMC561LP3 belongs to the HMC561G series of RF wireless miscellaneous components. It is designed for applications demanding wideband frequency multiplication in a small form factor. The device integrates advanced GaAs technology to achieve high performance in a leadless package suitable for automated surface mount assembly processes.

Replacement Considerations

No public confirmed substitute part numbers are available in the provided documentation.