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The HMC570 is a compact GaAs MMIC I/Q downconverter chip designed for the 17 to 21 GHz frequency range. It delivers a small signal conversion gain of 10 dB and a noise figure of 3 dB, with 17 dB of image rejection. The device operates from a single 3.5 V supply, drawing 125 mA. It features an integrated LNA followed by an active doubler and quadrature mixers. The component is supplied as a bare die in gel pack packaging, suitable for surface mount applications within a temperature range of -55°C to +85°C.
Verify that the specific procurement lot corresponds to the bare die configuration rather than packaged variants like the HMC570LC5TR. Confirm compatibility with custom substrate designs due to the exposed die format. Ensure handling procedures account for the sensitivity of the GaAs MMIC components during assembly.
Select this component when a bare die solution is required for the 17-21 GHz band with minimal footprint constraints. Compare against packaged alternatives if automated surface mount assembly is necessary without custom reflow profiles. Evaluate thermal management requirements given the power dissipation characteristics of the unencapsulated chip.
This part belongs to the HMC570G series of wireless and RF integrated circuits manufactured by Analog Devices. It represents a specialized millimeter-wave solution distinct from lower-frequency counterparts. The family focuses on high-performance I/Q processing for demanding RF environments requiring compact form factors.
Public confirmed substitute part numbers are not available.