HMC576

HMC576

  • Description:IC MULTIPLIER ACTIVE DIE
  • Series:-
  • Mfr:Analog Devices Inc.
  • Package:Tray

SKU:f4f9c1566987 Category: Brand:

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Product Detailed Parameters

  • Description:IC MULTIPLIER ACTIVE DIE
  • Series:-
  • Mfr:Analog Devices Inc.
  • Package:Tray
  • Function:Frequency Multiplier
  • Frequency:18GHz ~ 29GHz
  • RF Type:DBS, VSAT
  • Secondary Attributes:-
  • Mounting Type:Surface Mount
  • Package / Case:Die
  • Supplier Device Package:Die
  • Grade:-
  • Qualification:-

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HMC576

Overview

The HMC576 is an active broadband frequency multiplier die utilizing GaAs PHEMT technology. It operates as a x2 multiplier with an output frequency range of 18 GHz to 29 GHz. The device requires a supply voltage between 4.5 V and 5.5 V, drawing an operating current of 82 mA. Maximum power dissipation is rated at 709 mW. It functions effectively when driven by a +3 dBm input signal. The component is supplied in a die package format.

Feature Summary

  • Utilizes GaAs PHEMT technology for high-frequency performance
  • Provides x2 active frequency multiplication across a broad bandwidth
  • Designed for direct integration into RF signal chains

Applications

  • DBS (Direct Broadcast Satellite) systems
  • VSAT (Very Small Aperture Terminal) communications
  • Microwave radio links

Procurement Notes

Verify availability status carefully, as the HMC576 is frequently subject to limited supply conditions or discontinuation notices from major distributors. Confirm the specific manufacturing lot and datasheet revision before procurement. Ensure that the die form factor aligns with your assembly capabilities, as it requires specialized handling compared to packaged components. Cross-reference the manufacturer's official lifecycle status to avoid obsolescence risks during production planning.

Selection Notes

Select the HMC576 when a compact, high-performance frequency doubling solution is required for Ka-band applications. Its die configuration offers flexibility for custom substrate integration but demands precise thermal management due to its power dissipation characteristics. Consider the need for external matching networks and the specific drive level requirements (+3 dBm) when designing the preceding stage. Evaluate the trade-off between the broad operational bandwidth and the complexity of die-level mounting processes.

Part Context

The HMC576 belongs to Analog Devices' portfolio of RF microwave integrated circuits designed for satellite and wireless infrastructure. As a monolithic microwave integrated circuit (MMIC), it integrates the frequency multiplier function onto a single GaAs chip. This approach minimizes parasitic effects and enhances reliability compared to discrete implementations, supporting high-volume manufacturing for communication equipment requiring stable frequency synthesis.

Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation.

HMC576HMC576

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