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The HMC578-SX is a GaAs PHEMT MMIC x2 active frequency multiplier designed for output frequencies between 24 GHz and 33 GHz. It operates on a supply voltage ranging from 4.5 V to 5.5 V with a typical operating current of 81 mA. The component dissipates up to 703 mW of power and functions within a temperature range of -55°C to +85°C. Packaged as a bare die in a gel pack, it utilizes Silicon substrate technology for high-frequency signal multiplication applications.
Verify the specific suffix 'SX' indicates the bare die configuration in gel pack packaging rather than a packaged module. Confirm that the supplier provides official Analog Devices documentation for the die variant. Ensure handling procedures account for the sensitive nature of unpackaged semiconductor dies during assembly.
Select this component when a compact, high-frequency multiplier is required for mmWave designs. Consider the GaAs PHEMT technology for performance characteristics suitable for satellite downlink frequencies. Evaluate the bare die format against board space constraints and custom mounting requirements compared to packaged alternatives.
This part belongs to the HMC578G series of RF wireless miscellaneous components. It serves as the die-level version of the HMC578LC3BTR-R5 surface mount device. The SX suffix specifically denotes the unpackaged die form factor intended for advanced packaging solutions.
HMC578LC3BTR-R5