HMC578-SX

HMC578-SX

$86.46
  • Description:IC MULTI X2 ACTIVE DIE
  • Series:-
  • Mfr:Analog Devices Inc.
  • Package:Tray

SKU:1903c998bf21 Category: Brand:

  
  • Quantity
    • -
    • +
  •    
ChipApex WhatsApp

Consult the customer manager about the wholesale price.

consultation hotline:86-132-6715-2157

email:[email protected]
Contact the product manager for consultation. One-stop consultation is available.


Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.

Submitting!
Submission successful!
Submission failed!
Email error!
Phone number error!

Product Detailed Parameters

  • Description:IC MULTI X2 ACTIVE DIE
  • Series:-
  • Mfr:Analog Devices Inc.
  • Package:Tray
  • Function:Frequency Multiplier
  • Frequency:24GHz ~ 33GHz
  • RF Type:DBS, VSAT
  • Secondary Attributes:-
  • Mounting Type:Surface Mount
  • Package / Case:Die
  • Supplier Device Package:Die
  • Grade:-
  • Qualification:-

Download product information

HMC578-SX

Overview

The HMC578-SX is a GaAs PHEMT MMIC x2 active frequency multiplier designed for output frequencies between 24 GHz and 33 GHz. It operates on a supply voltage ranging from 4.5 V to 5.5 V with a typical operating current of 81 mA. The component dissipates up to 703 mW of power and functions within a temperature range of -55°C to +85°C. Packaged as a bare die in a gel pack, it utilizes Silicon substrate technology for high-frequency signal multiplication applications.

Feature Summary

  • Active broadband frequency multiplication using GaAs PHEMT technology
  • Designed for direct integration into millimeter-wave circuits
  • Operates across the 24 GHz to 33 GHz output spectrum

Applications

  • VSAT communication systems
  • DBS (Direct Broadcast Satellite) receivers
  • Millimeter-wave test and measurement equipment

Procurement Notes

Verify the specific suffix 'SX' indicates the bare die configuration in gel pack packaging rather than a packaged module. Confirm that the supplier provides official Analog Devices documentation for the die variant. Ensure handling procedures account for the sensitive nature of unpackaged semiconductor dies during assembly.

Selection Notes

Select this component when a compact, high-frequency multiplier is required for mmWave designs. Consider the GaAs PHEMT technology for performance characteristics suitable for satellite downlink frequencies. Evaluate the bare die format against board space constraints and custom mounting requirements compared to packaged alternatives.

Part Context

This part belongs to the HMC578G series of RF wireless miscellaneous components. It serves as the die-level version of the HMC578LC3BTR-R5 surface mount device. The SX suffix specifically denotes the unpackaged die form factor intended for advanced packaging solutions.

Replacement Considerations

HMC578LC3BTR-R5

HMC578-SXHMC578-SX
$86.46
Buy Now