HMC6147ALC5ATR-R5

Overview

The HMC6147ALC5ATR-R5 is a GaAs MMIC I/Q downconverter from Analog Devices, operating in the 37 GHz to 40 GHz RF range. It features an LO frequency range of 16.5 GHz to 22 GHz and an IF bandwidth from 0 Hz to 4 GHz. Key electrical parameters include a gain of 13 dB, a noise figure of 3.5 dB, and a P1dB compression point of 1 dBm. The device requires a single 3 V supply with currents of 75 mA and 150 mA. It is housed in a QFN-EP-16 package.

Feature Summary

• Integrated I/Q architecture for direct downconversion
• GaAs MMIC technology for high-frequency performance
• Compact leadless surface-mount packaging

Applications

• Point-to-point microwave radio links
• Satellite communication ground stations
• Electronic warfare systems
• Test and measurement equipment

Procurement Notes

Verify component authenticity through authorized channels due to limited availability status. Confirm RoHS compliance details prior to integration. Ensure storage conditions account for moisture sensitivity classification. Validate package marking against official datasheet specifications to prevent counterfeit substitution during procurement.

Selection Notes

Select this component for applications requiring low noise figure and high linearity in the Ka-band spectrum. The integrated I/Q structure simplifies system design by eliminating external quadrature hybrids. Consider the specific power consumption requirements relative to the 3 V supply constraint when designing thermal management solutions for dense PCB layouts.

Part Context

This part belongs to the HMC6147A series of wireless and RF integrated circuits. It is functionally related to the HMC6147ALC5A variant, differing primarily in tape and reel packaging configuration. Both devices share identical electrical characteristics and are designed for millimeter-wave downconversion tasks within Analog Devices' portfolio.

Replacement Considerations

The HMC6147ALC5A serves as a verified substitute part number with identical electrical specifications. Verify that the alternative package variant meets the same mechanical footprint and thermal pad requirements for direct board replacement.