HMC674LC3C

Overview

The HMC674LC3C is a silicon germanium monolithic ultrafast comparator featuring reduced swing positive emitter-coupled logic (RSPECL) output drivers and latch inputs. It supports 10 Gbps operation with an equivalent input bandwidth of 9.3 GHz typical and propagation delay of 85 ps typical. The device operates on VCCI from 3.135 V to 3.465 V, VCCO from 1.8 V to 3.465 V, and VEE at -3.0 V. Power dissipation is typically 140 mW. It includes resistor-programmable hysteresis and differential latch control within a 16-terminal ceramic leadless chip carrier package.

Feature Summary

• Features a high-speed latch for holding comparison results in latch mode or tracking inputs in transparent mode.
• Includes RSPECL output stages capable of directly driving 400 mV into a 50 Ω resistor terminated to VTT.
• Supports resistor-programmable hysteresis via the HYS pin to prevent false triggering.
• Utilizes silicon germanium technology for ultrafast response and low jitter performance.

Applications

• Automatic test equipment (ATE)
• High speed instrumentation
• Digital receiver systems
• Pulse spectroscopy
• Clock and data restoration

Procurement Notes

Verify the specific package option required, as the LC3C suffix denotes a 16-terminal ceramic leadless chip carrier (LCC). Confirm power supply requirements match the specified VCCI, VCCO, and VEE levels. Ensure ESD precautions are taken during handling due to sensitivity. Check for moisture sensitivity level (MSL) constraints if storage conditions vary. Validate that the application circuit utilizes proper RF design techniques for signal integrity.

Selection Notes

Select this component when a latched comparator with RSPECL outputs is required for 10 Gbps applications. Consider the 85 ps propagation delay and 9.3 GHz bandwidth for high-speed signal processing. Evaluate the need for programmable hysteresis to manage noise immunity. Compare package options if thermal or mechanical constraints differ, noting the LC3C uses a ceramic LCC while LP3E uses plastic LFCSP. Ensure the system can provide the necessary negative supply voltage.

Part Context

The HMC674 series comprises silicon germanium comparators designed for broadband communications and ATE. The HMC674LC3C specifically utilizes a ceramic leadless chip carrier package, distinguishing it from the plastic LFCSP variant. Both variants share identical electrical characteristics but differ in physical construction and thermal resistance. This family targets applications requiring precise timing and high-speed signal digitization.

Replacement Considerations

HMC674LP3E is a direct functional substitute using a plastic LFCSP package instead of ceramic LCC. Verify package footprint compatibility before substitution. Electrical specifications remain identical between the two part numbers.