HMC674LC3CTR-R5

Overview

The HMC674LC3CTR-R5 is a silicon germanium monolithic ultrafast comparator featuring RSPECL output drivers and latch inputs. It supports 10 Gbps operation with a typical propagation delay of 85 ps and an equivalent input bandwidth of 9.3 GHz. The device operates on a +3.3 V supply for the input stage, +2.0 V for the output stage, and -3.0 V negative supply, dissipating 140 mW. It includes resistor-programmable hysteresis and differential latch control within a 16-terminal ceramic leadless chip carrier package.

Feature Summary

• Features reduced swing positive emitter-coupled logic (RSPECL) output stages that directly drive 400 mV into a 50 Ω resistor terminated to VTT.
• Includes a high-speed latch and programmable hysteresis controlled via an external resistor connected to the HYS pin.
• Operates in either track mode or latch mode using differential latch enable inputs.

Applications

• Automatic test equipment (ATE)
• High speed instrumentation
• Digital receiver systems
• Pulse spectroscopy
• Clock and data restoration

Procurement Notes

Verify the specific ordering suffix against the manufacturer's official documentation to confirm packaging details. The datasheet indicates that the R5 suffix corresponds to tape and reel packaging for the 16-terminal LCC variant. Ensure compatibility with the required moisture sensitivity level and operating temperature range specifications before procurement.

Selection Notes

Select this component when designing circuits requiring sub-100 ps propagation delay and support for 10 Gbps data rates. The device is suitable for applications needing precise timing resolution with low jitter characteristics. Consider the available packages based on thermal management requirements and PCB layout constraints for RF grounding.

Part Context

This part belongs to the HMC674 series of ultrafast comparators manufactured by Analog Devices. The series utilizes silicon germanium technology to achieve high-speed performance. The LC3C variant specifically denotes the ceramic leadless chip carrier package option, distinguishing it from plastic LFCSP alternatives within the same functional family.

Replacement Considerations

HMC674LP3E