HMC679LC3CTR-R5

Overview

The HMC679LC3CTR-R5 is a high-speed T-type flip-flop with reset functionality manufactured by Analog Devices Inc. It operates at frequencies up to 26 GHz and is housed in an SMT-16 surface-mount package. This component is designed for demanding digital applications requiring precise timing control and data synchronization at microwave frequencies.

Feature Summary

• Supports operation at clock frequencies up to 26 GHz
• Integrates T-type flip-flop logic with asynchronous reset capability
• Utilizes a compact SMT-16 surface-mount package for board integration

Applications

• High-speed serial data recovery circuits
• Microwave frequency divider designs
• Digital phase-locked loop (PLL) feedback paths

Procurement Notes

Verify current availability status as the component may be subject to limited supply or obsolescence. Confirm that the SMT-16 package dimensions match your PCB footprint requirements. Ensure compatibility with 26 GHz signal integrity standards during layout. Check for any specific handling instructions regarding moisture sensitivity levels before assembly.

Selection Notes

Select this component when a dedicated high-speed flip-flop with reset is required for frequencies approaching 26 GHz. Consider the SMT-16 form factor for space-constrained layouts. Evaluate power consumption and thermal dissipation characteristics relative to system constraints. Compare against alternative logic families if lower frequency operation suffices for the application.

Part Context

This device belongs to the HMC679 series of high-speed digital components from Analog Devices. It complements other RF and microwave integrated circuits within the manufacturer's portfolio, targeting applications where fast switching speeds and reliable state retention are critical for system performance.

Replacement Considerations

Check for direct pin-compatible substitutes within the same family. Verify electrical specifications such as maximum operating frequency and reset behavior. Ensure package compatibility and thermal management requirements align with existing designs.