HMC774-SX

RF Mixers Overview

The HMC774-SX is a general-purpose double-balanced mixer die manufactured by Analog Devices Inc. It operates within a frequency range of 7 GHz to 43 GHz and functions as an upconverter or downconverter. The component requires no DC bias, classifying it as a passive device. It features a typical input IP3 of 20 dBm. The unit is supplied in a die package format with surface mount mounting type.

RF Mixers Feature Summary

• Double-balanced mixer architecture for general-purpose RF applications
• Passive operation eliminating the need for DC bias voltage
• Capable of functioning as both upconverter and downconverter

RF Mixers Applications

• RF signal conversion between 7 GHz and 43 GHz
• Upconversion stages in microwave transmitters
• Downconversion stages in microwave receivers

RF Mixers Procurement Notes

Verify the specific ordering suffix against official Analog Devices documentation to ensure correct package configuration. Confirm that the die form factor aligns with your assembly capabilities. Check current product status as components may be subject to discontinuation notices. Ensure compatibility with your RF layout requirements for this specific mixer die.

RF Mixers Selection Notes

Select this component when a wideband double-balanced mixer is required without DC bias complexity. Consider the die package size and mounting constraints during PCB design. Evaluate the 20 dBm typical input IP3 against system linearity requirements. Verify that the 7-43 GHz operational range covers all intended signal frequencies.

RF Mixers Part Context

The HMC774-SX belongs to the HMC774 series of RF mixers from Analog Devices. It shares functional characteristics with leadless SMT variants like the HMC774LC3B but differs in physical packaging. The series provides general-purpose mixing solutions for high-frequency wireless systems.

RF Mixers Replacement Considerations

The HMC774LC3B is a documented leadless RoHS compliant SMT package variant of the same mixer function. Verify pinout and thermal requirements when substituting between die and SMT packages.