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HMC774 is listed in the RF Mixers range at ChipApex. The manufacturer field lists Analog Devices Inc.. Its product description is IC MMIC MIXER DBL-BAL DIE. Review the specifications below when checking this part for your BOM.
The HMC774 is a GaAs MMIC fundamental mixer from Analog Devices, operating across a frequency range of 7 GHz to 43 GHz. It functions as a universal double-balanced mixer suitable for both up-conversion and down-conversion applications. The device is available in a bare die configuration (HMC774) and a leadless SMT package (HMC774LC3B). Key electrical specifications include a maximum conversion loss of 15.5 dB and a noise figure of 12 dB. The local oscillator frequency spans 7 GHz to 34 GHz, while the intermediate frequency ranges from 0 Hz to 8 GHz. The component supports a maximum power dissipation of 189 mW and operates within a temperature range of -55°C to +85°C.
Verify specific package variant requirements, as the HMC774 series includes distinct bare die and SMT options. Confirm RoHS compliance status for the selected version. Check current lifecycle status, as some variants may be obsolete or limited. Ensure thermal management design accounts for the 189 mW power dissipation limit. Validate that the application frequency falls within the specified 7-43 GHz operational range.
Select the HMC774 for applications requiring wideband mixing between 7 GHz and 43 GHz. Choose the LC3B package for surface-mount assembly needs or the bare die for custom integration. Consider the 15.5 dB max conversion loss and 12 dB noise figure when designing low-noise chains. Ensure the LO drive levels match the fundamental mixer requirements. Evaluate thermal constraints given the 189 mW dissipation capability.
The HMC774 belongs to Analog Devices' HMC774 family of RF mixers. This series includes variants like the HMC774A-SX and HMC774ALC3B, which share similar core functionalities but differ in packaging and specific frequency optimizations. The family utilizes GaAs MMIC technology to provide robust performance in demanding wireless environments.
The HMC774LC3B is a direct leadless SMT package alternative to the bare die HMC774. Verify pinout compatibility and thermal characteristics when substituting between these variants. Other family members like HMC774A-SX offer different packaging options.
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