HSP43216JI-52

Overview

The HSP43216JI-52 is a high-speed static RAM component manufactured by Harris Corporation. It features a memory organization of 2K words by 16 bits, providing a total capacity of 32 kilobits. The device operates with a maximum access time of 52 nanoseconds, ensuring rapid data retrieval for demanding applications. It utilizes CMOS technology and supports asynchronous operation modes. The unit is housed in a ceramic dual in-line package (CDIP) designed for robust performance across extended temperature ranges, typically spanning from -55°C to +125°C. Key electrical characteristics include specific supply voltage requirements and low standby current capabilities inherent to its CMOS architecture.

Feature Summary

• High-speed data access suitable for complex processing tasks
• Robust ceramic packaging for harsh environment reliability
• Asynchronous operation with on-chip address latches

Applications

• Military avionics systems requiring radiation tolerance
• Industrial control units operating in extreme temperatures
• Test and measurement equipment needing fast memory cycles

Procurement Notes

Verify the manufacturer origin carefully, as Harris Semiconductor assets were acquired by Renesas Electronics. Confirm that the specific part number corresponds to the original Harris production run if legacy support or specific historical specifications are required. Check for RoHS compliance status, as older ceramic DIP versions may not meet modern environmental directives. Ensure the supplier provides traceability documentation for critical aerospace or defense contracts.

Selection Notes

Select this component when a 2Kx16 SRAM configuration with sub-60ns access speed is mandatory. Consider the CDIP package constraints regarding board space and mounting methods compared to surface-mount alternatives. Evaluate the thermal management requirements associated with the specified operating temperature range. Verify compatibility with existing system voltage levels and interface logic families before integration.

Part Context

This part belongs to the Harris HSP series of high-performance static random-access memories. These components were widely utilized in specialized computing and communication systems during the era of ceramic packaged electronics. The series is characterized by its focus on speed and reliability for mission-critical applications where standard plastic packages might fail under stress.

Replacement Considerations

Direct pin-to-pin replacements may be limited due to the specific ceramic DIP form factor. Modern equivalents often utilize surface-mount technologies such as TSOP or BGA packages. If a direct substitute is unavailable, adapter sockets or redesigning the PCB footprint may be necessary. Consult Renesas Electronics for current portfolio options that match the electrical specifications.