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The HSP50214VC is a programmable downconverter integrated circuit manufactured by Harris Corporation. Designed for RF applications, it supports AMPS, CDMA, GSM, and North American TDMA standards. The device functions as a secondary converter within radio systems. It is housed in a 120-BQFP surface-mount package with dimensions of 28x28 mm. The component is currently active and available for procurement.
Verify RoHS compliance status prior to integration, as the component is listed as non-compliant. Confirm moisture sensitivity level (MSL 3) handling requirements during storage and reflow processes. Ensure the 120-BQFP footprint matches the target PCB design. Check current availability through authorized distributors or Rochester Electronics LLC for lead time accuracy.
Select this component for legacy cellular infrastructure requiring specific downconversion capabilities for AMPS, CDMA, GSM, or NA TDMA bands. The 120-pin BQFP package requires adequate PCB space and thermal management considerations. Verify compatibility with existing system clocking and control interfaces before finalizing the bill of materials.
Harris Corporation specialized in wireless communications and defense electronics. The HSP50214VC belongs to their RF IC portfolio targeting cellular base stations and mobile terminals. This part represents legacy technology from the era when Harris was a primary supplier for these specific analog front-end solutions.
No public confirmed substitute part numbers are documented. Evaluate pin-compatible alternatives only if original supply is discontinued.