HSP5F3AS

Overview

The SolaHD HSP5F3AS is a single-phase, encapsulated automation transformer with a 3 kVA power rating. It features a primary voltage configuration of 240 x 480 VAC and a secondary output of 120/240 VAC. The unit operates at 60 Hz and utilizes wire lead terminations. Designed as a dry type distribution transformer, it supports a +115K temperature rise and complies with ANSI C57.12.00 standards.

Feature Summary

• Encapsulated construction seals windings against moisture and dirt
• IP20 touch-proof termination design for safety
• Copper winding technology for efficient energy transfer
• Non-ventilated thermal management suitable for enclosed panels

Applications

• Industrial machinery control circuits
• Automation equipment power isolation
• OEM system integration
• General purpose distribution in industrial settings

Procurement Notes

Verify the specific ordering suffix matches the required voltage and terminal configuration. Confirm that the encapsulated design aligns with the installation environment's thermal and spatial constraints. Ensure compatibility with existing panel wiring methods before finalizing procurement orders.

Selection Notes

Select this model when a non-ventilated, encapsulated solution is required for 3 kVA applications. The dual primary voltage options (240/480V) provide flexibility for different input sources. Verify that the IP20 protection level meets the environmental requirements of the intended installation site.

Part Context

This component belongs to the SolaHD HSP series of encapsulated automation transformers. These units are designed for industrial environments where space is limited and protection against contaminants is necessary. The series emphasizes durability through epoxy encapsulation and copper windings.

Replacement Considerations

Direct substitutes include models within the same HSP series from SolaHD that match the 3 kVA rating and voltage specifications. Cross-reference part numbers such as HS5F3AS variants if vented designs are acceptable, though encapsulation differences may affect thermal performance.