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HTMS-114-02-T-S is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists Samtec Inc.. Its product description is CONN HDR .050" 11POS. Review the specifications below when checking this part for your BOM.
The HTMS-114-02-T-S is a .100" (2.54 mm) pitch through-hole terminal strip manufactured by Samtec Inc. This component features a single row of contacts with a total of 14 positions, arranged in a double-row header configuration for mating purposes. The contact system utilizes a .032" (.81 mm) square post design to ensure reliable connection stability. It supports mixed technology termination options, allowing compatibility with various board layouts. The unit is rated for up to 8 Gbps performance and meets MIL-DTL-55302 testing standards.
Verify the specific suffix codes against the official Samtec series print to confirm pin orientation and termination style. Ensure the selected variant matches the required current rating and environmental compliance standards for your application. Cross-reference the part number with the latest catalog pages to avoid ordering obsolete configurations.
Select this component when a .100" pitch through-hole solution is required for high-speed signals up to 8 Gbps. Consider the mixed technology termination if standard surface mount or through-hole methods do not fit the assembly constraints. Verify that the square post contact system aligns with the mating connector's socket specifications for optimal engagement.
This part belongs to the HTMS family of terminal strips, which are engineered for durability in demanding applications. The series offers various row counts and termination styles to support complex PCB designs. As an Extended Life Product, it undergoes rigorous testing to ensure longevity and performance consistency across different operational cycles.
Consult the official Samtec cross-reference guide for verified substitute part numbers. Ensure any replacement maintains the same .100" pitch and contact system dimensions to guarantee mechanical and electrical compatibility without redesigning the footprint.
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