HV53001-E/KWX

Specialized ICS Overview

The HV53001-E/KWX is a high-voltage driver integrating 16 push-pull channels, an SPI interface, and a DC/DC boost converter. It generates ±135V output swings with a minimum source/sink current of 24 mA per channel, supporting loads up to 250 pF. The device accepts a single 2.7V to 5.5V input supply to power internal charge pumps and the boost controller. Key features include Return-To-Zero (RTZ) functionality, global current sensing via VPPSENSE/VNNSENSE pins, and integrated safety protections for overvoltage, short circuits, and overtemperature conditions.

Specialized ICS Feature Summary

• 16-Channel Push-Pull Output: Capable of ±135V swing with 24 mA minimum drive current and 250 pF load capacity.
• Integrated Boost Converter: Internal DC/DC controller with power MOSFET generates required high-voltage rails from a 2.7V–5.5V input.
• Current Sensing: Global analog output mapping charge/discharge currents with a scale factor of 3.1 V/V.
• Safety Protections: Includes overvoltage protection, short circuit detection, and overtemperature monitoring with fault signaling.

Specialized ICS Applications

• Surface Haptic Actuators
• MEMS Drivers
• Piezo Drivers

Specialized ICS Procurement Notes

Verify the ordering suffix 'E/KWX' against the manufacturer's official documentation to confirm package type and temperature grade specifications. Ensure compatibility with the 105-ball TFBGA footprint during PCB layout. Confirm RoHS compliance status through the latest datasheet revision notes before finalizing procurement orders.

Specialized ICS Selection Notes

Select this component when driving capacitive loads up to 250 pF at high voltages requiring precise current monitoring. The integrated boost converter simplifies design by eliminating external high-voltage generation components. Ensure the host MCU supports 3.3V logic levels and SPI clock speeds up to 32 MHz for optimal data transfer rates.

Specialized ICS Part Context

This device belongs to Microchip's specialized high-voltage driver family designed for compact integration. It consolidates driver, control, and power generation functions into a single 9x9 mm TFBGA package. This integration reduces board space and component count compared to discrete solutions using separate drivers and boost controllers.

Specialized ICS Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation. Verify pin-to-pin compatibility and electrical parameter overlaps with alternative high-voltage drivers if cross-referencing is required.