HXT44420-DNG

HXT44420-DNG

  • Description:IC AMPLIFIER TIA
  • Series:-
  • Mfr:Renesas Electronics Corporation
  • Package:Tray

SKU:76a79d68db42 Category: Brand:

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Product Detailed Parameters

  • Description:IC AMPLIFIER TIA
  • Series:-
  • Mfr:Renesas Electronics Corporation
  • Package:Tray
  • Type:-
  • Applications:-
  • Mounting Type:-
  • Package / Case:-
  • Supplier Device Package:-
  • Grade:-
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HXT44420-DNG

Overview

The HXT44420-DNG is a quad-channel, low-power linear PAM4 Directly Modulated Laser (DML) driver designed for Long Reach (LR) optical applications. It supports signaling rates up to 28GBaud or 56Gbps PAM4. The device handles complete electrical-to-optical conversion, including CML input with equalization, laser bias and modulation control, and supervision. It integrates Automatic Power Control (APC), internal and module temperature measurements, and receive power monitoring via an RSSI input. Designed as a directly DC-coupled die for Transmitter Optical Sub-Assembly (TOSA) applications, it reduces discrete component count for compact, cost-effective assemblies.

Feature Summary

  • Quad-channel linear PAM4 DML driver supporting up to 56Gbps data rates
  • Integrated Automatic Power Control (APC) and comprehensive supervision functions
  • Built-in temperature sensors for internal and external module monitoring
  • Directly DC-coupled die design optimized for TOSA integration

Applications

  • Long Reach (LR) optical transceivers
  • Transmitter Optical Sub-Assemblies (TOSA)
  • High-speed fiber optic communication systems

Procurement Notes

Verify the specific suffix 'DNG' against official Renesas documentation to confirm package configuration and calibration status. Ensure compatibility with target TOSA designs requiring direct DC coupling. Confirm that the die form factor aligns with assembly capabilities. Cross-reference pinout and interface specifications with the latest datasheet to avoid integration errors during PCB layout and system validation.

Selection Notes

Select this component for applications requiring high-speed PAM4 signaling in LR optical modules. The integrated APC and monitoring features simplify system design by reducing external component requirements. Consider the die-level packaging when evaluating assembly processes and thermal management strategies. Verify that the CML input interface matches the source driver specifications for optimal signal integrity at 56Gbps speeds.

Part Context

This part belongs to Renesas Electronics' laser driver portfolio, specifically engineered for high-bandwidth optical interconnects. It complements other components in the optical transmission chain by providing precise laser control and monitoring. The device addresses the growing demand for efficient, compact solutions in data center and telecommunications infrastructure where space and power constraints are critical.

Replacement Considerations

Consult official Renesas substitution lists for verified alternatives. Generic equivalents may not match the integrated APC or DC-coupled die characteristics required for TOSA applications.

HXT44420-DNGHXT44420-DNG

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