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IBM25PPC750GLECB5H63T is listed in the Microprocessors range at ChipApex. The manufacturer field lists IBM. Its product description is IBM25PPC750 - POWERPC 750GL RISC. Review the specifications below when checking this part for your BOM.
The IBM25PPC750GLECB5H63T is a PowerPC 750GL RISC microprocessor manufactured by IBM. It features a 32-bit architecture with an external data bus width of 64 bits and supports boundary scan testing. The component operates at a maximum clock frequency of 200 MHz and includes integrated cache capabilities. It utilizes a CBGA-292 ceramic package measuring 21x21 mm with a 1 mm pitch, containing 292 terminals. The device supports floating-point operations and includes low-power modes, with a maximum operating temperature of 105 °C.
Verify the specific ordering suffix against official IBM documentation to confirm pinout and electrical characteristics. Ensure compliance with export control classifications (ECCN 3A001.A.3) applicable to this semiconductor technology. Confirm that the CBGA-292 ceramic package matches the target board design requirements before procurement.
Select this component when a 32-bit RISC processor with integrated cache and boundary scan support is required. The 200 MHz clock speed and 64-bit external data bus define its performance envelope. Consider the CBGA-292 ceramic package constraints for thermal management and mechanical mounting in the final application design.
This part belongs to the IBM PowerPC 750 series, a family of embedded processors widely used in telecommunications and industrial applications. The 750GL variant specifically targets high-performance embedded environments. The GLEC suffix indicates specific package and temperature grade variations within the broader 750 product line.
Publicly confirmed substitute part numbers are not available in the provided source material. Cross-reference with IBM's official obsolescence notices or authorized distributor substitution guides for equivalent PowerPC 750 variants.
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